M.Sc. Subbiah - Publikationsliste

• Konferenzbeiträge

Konferenzbeiträge

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2020

• Subbiah N, Schiffmacher A, Song X, Wilde J
  Comparison of Silver Sintered Assemblies on Non-DCB Substrates
  2020 CIPS 2020; 11th International Conference on Integrated Power Electronics Systems, Berlin, Germany, pp. 1-7.
  
   
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2019

• Subbiah N, Feng Q, Wilde J
  High-Temperature Pressure Sensor Package and Characterization of thermal stress in the assembly up to 500 °C
  2019 IEEE 69th Electronic Components and Technology Conference , Seiten: 878 - 883

2018

• Subbiah N, Bruckner G, Beltran Ramirez K, Wilde J
  Concept and Implementation of High-Temperature Pressure Sensor Package up to 500 °C
  2018 19th ITG/GMA-Symposium, Sensors and Measuring Systems (SENSOR), Nürnberg, Seiten: 55 - 60
• Subbiah N, Beltran Ramirez K, Wilde J
  Concept and Implementation of High-Temperature Pressure Sensor Package up to 500 °C
  2018 Sensoren und Messsysteme, 26. - 27.Juni 2018 in Nürnberg , Seiten: 55 - 60
• Subbiah N, Feng Q, Beltran Ramirez K, Wilde J
  Flip-chip Die Attachment for High-temperature Pressure Sensor Packages up to 500 °C
  2018
• Subbiah N, Feng Q, Beltran Ramirez K, Wilde J
  Implementation of High-Temperture Pressure Sensor Package and Characterization up to 500 °C
  2018 2018 20th Electronics Packaging Technology Conference

2017

• Subbiah N, Ghosh S, Zeiser R, Wilde J
  Comparison of packaging concepts for high-temperature pressure sensors at 500°C
  2017 IEEE 67th Electronic Components & Technology Conference (ECTC), Orlando, Fl, USA
• Subbiah N, Feißt M, Zeiser R, Möller E, Wilde J
  New materials, processes and design methods for the chip mounting of high-temperature sensors
  2017 18th International Conference on Sensors and Measurement Technology (SENSOR), Nürnberg