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2021

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• Gerbella M, Borra E, Pothof F, Lanzilotto M, Livi A, Fogassi L, Paul O, Orban G A, Ruther P, Bonini L
  Histological assessment of a chronically implanted cylindrically-shaped, polymer-based neural probe in the monkey
  2021 Journal of Neural Engineering, Band: 18, Nummer: 024001
• Fiath R, Meszena D, Somogyvari Z, Boda M, Bartho P, Ruther P, Ulbert I
  Recording site placement on planar silicon-based probes affects signal quality in acute neuronal recordings
  2021 Scientific Reports

2020

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• Barz F, Trouillet V, Paul O, Ruther P
  CMOS-compatible, Flexible, Intracortical Neural Probes
  2020 IEEE T Bio-med Eng, Band: 67, Nummer: 5, Seiten: 1366 - 1376
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  Kurzfassung

  Flexible intractorical neural probes elicit a lower foreign body response when compared to rigid implants. However, by incorporating complementary metal-oxide-semiconductor (CMOS) circuitry, silicon-based neural probes can offer an improved scalability and more functionalities than any other currently available technology. Objective: Our goal is the development of a novel neural probe that combines flexibility with the functionalities of active CMOS-based probes. Methods: We interface CMOS-based probe tips of only a few millimeters in length with flexible polyimide cables, which enable the complete implantation of the tips into brain tissue. The multilayer platinum metallization of the cables is patterned using a novel combination of ion beam and plasma etching. Implantation of the flexible probes is verified in brain models using stiff insertion shuttles. Result: We assembled neural probes from passive and active tips as short as 1.5 mm and less than 180 µm in width. Active probes feature electrode arrays with 72 recording sites and multiplexing to 16 parallel output lines. We reliably patterned cables with signal lines of 2 µm in width and 3 µm in spacing. Ion beam etching deteriorated the composition of the polyimide substrate and its resistance to around 1 kΩ. An additional plasma treatment re-established high insulation resistances and recovered the chemical composition. Probes were successfully implanted to a depth of 7 mm using insertion shuttles and withstood forces of 63 mN. Conclusions: This study presents the methods required for the fabrication and application of a new generation of neural probes. Significance: The synergetic approach surpasses the limitation of each individual probe technology and should be considered in future developments.
• , Ayub S, David F, Klein E, Borel M, Paul O, Gentet L J, Ruther P
  Compact optical neural probes with up to 20 integrated thin-film μLEDs applied in acute optogenetic studies
  2020 IEEE T Bio-med Eng, Band: 67, Nummer: 9, Seiten: 2603 - 2615
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  This paper reports on the development, characterization and in vivo validation of compact optical neural probes. These novel intracerebral devices comprise micro light-emitting diodes (μLEDs) integrated along their slender probe shanks with up to 20 μLEDs per device. Blue light with a peak wavelength of 455nm is emitted from circular apertures 100μm in diameter. The μLEDs are structured on GaN-on-sapphire wafers and subsequently transferred onto silicon (Si) carrier wafers. The wafer-scale transfer process provides the opportunity to process the functional GaN layer stack from both sides and hence enables maximizing the efficiency of the μLEDs. Combined with standard MEMS fabrication processes for Si, linear μLED arrays with small inter-μLED distances are achieved on thin probe shanks with cross-sections measuring 150μm × 65 μm. Devices are interconnected using highly flexible polyimide cables in order to mechanically decouple them from the peripheral electronics during in vivo experiments. Assembled probes emit a peak optical radiant flux of 440μW (emittance 56mWmm−2 ) at 5mA driving current. Thermal characterization of test probes reveals a temperature increase of 1.5K measured using an integrated thermistor. Electrical functionality stress tests have been carried out to evaluate the device passivation against the physiological environment. It is estimated to endure at least 48 h during continuously pulsed μLED operation. A compact driving circuitry enables low-noise μLED operation in in vivo optogenetic experiments. The radiant flux necessary to elicit an acceptable neuronal response is determined between 1.36μW and 17.5 μW. Probe validation successfully demonstrates the layer-specific stimulation in the cortex in multiple in vivo trials.
• Lukasz Jablonski L, Harczos T, Wolf B, Hoch G, Dieter A, Hessler R, Ayub S, Ruther P, Moser M
  Hearing restoration by a low-weight power-efficient multichannel optogenetic cochlear implant system
  2020 bioRxiv
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  Kurzfassung

  In case of deafness, cochlear implants bypass dysfunctional or lost hair cells by direct electrical stimulation (eCIs) of the auditory nerve. However, spectral selectivity of eCI sound coding is low as the wide current spread from each electrode activates large sets of neurons that align to a place-frequency (tonotopic) map in the cochlea. As light can be better confined in space, optical cochlear implants (oCIs) promise to overcome this shortcoming of eCIs. This requires fine-grained, fast, and power-efficient real-time sound analysis and control of multiple microscale emitters. Here, we describe the development, characterisation, and application for hearing restoration of a preclinical low-weight and wireless LED-based multichannel oCI system and its companion eCI system. The head-worn oCI system enabled deaf rats to perform a locomotion task in response to acoustic stimulation proofing of concept of multichannel optogenetic hearing restoration in rodents.
  
  
   
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• Klein L, Pothof F, Raducanu BC, Klon-Lipok J, Shapcott KA, Musa S, Andrei A, Aarts AA, Paul O, Singer Wolf, Ruther P
  High-density electrophysiological recordings in macaque using a chronically implanted 128-channel passive silicon probe
  2020 J Neural Eng, Band: 17, Nummer: 2, Seite: 026036
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  Kurzfassung

  Objective. The analysis of interactions among local populations of neurons in the cerebral cortex (e.g. within cortical microcolumns) requires high resolution and high channel count recordings from chronically implanted laminar microelectrode arrays. The request for high-density recordings of a large number of recording sites can presently only be accomplished by probes realized using complementary metal-oxide-semiconductor (CMOS) technology. In preparation for their use in non-human primates, we aimed for neural probe validation in a head-fixed approach analyzing the long-term recording capability. Approach. We examined chronically implanted silicon-based laminar probes, realized using a CMOS technology in combination with micromachining, to record from the primary visual cortex (V1) of a monkey. We used a passive CMOS probe that had 128 electrodes arranged at a pitch of 22.5 µm in four columns and 32 rows on a slender shank. In order to validate the performance of a dedicated microdrive, the overall dimensions of probe and interface boards were chosen to be compatible with the final active CMOS probe comprising integrated circuitry. Main results. Using the passive probe, we recorded simultaneously local field potentials (LFP) and spiking multiunit activity (MUA) in V1 of an awake behaving macaque monkey. We found that an insertion through the dura and subsequent readjustments of the chronically implanted neural probe was possible and allowed us to record stable LFPs for more than five months. The quality of MUA degraded within the first month but remained sufficiently high to permit mapping of receptive fields during the full recording period. Significance. We conclude that the passive silicon probe enables semi-chronic recordings of high quality of LFP and MUA for a time span exceeding five months. The new microdrive compatible with a commercial recording chamber successfully demonstrated the readjustment of the probe position while the implemented plug structure effectively reduced brain tissue movement relative to the probe.
• Klein E, Huber K, Paul O, RutherP
  Low-temperature plasma annealing of sputtered indium tin oxide for transparent and conductive thin-films on glass and polymer substrates
  2020 Thin Solid Films, Band: 693, Nummer: 1, Seite: 137715
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  This paper reports on the development of a low-temperature plasma annealing process for indium tin oxide (ITO) thin-films deposited by magnetron sputtering. The study investigates the influence of the type of plasma (argon (Ar) vs. oxygen (O2)) and its duration on the optical transmission coefficient and electrical resistivity of the films depending on the power and O2 concentration during their deposition. A low sputtering power of 100 W combined with an O2 concentration of 6 vol% followed by a 40-min Ar plasma anneal at 300 W produces ITO films with an average transmission of 94% in the visible spectrum and a resistivity of  2.3 e-3 Ohm cm. Sputtering without O2 results in a transmission of 89% and a resistivity of  9 e-4 Ohm cm. The annealing depth is found to be 370 nm. We deposited and annealed conductive, transparent ITO tracks below 50 ∘C on a polyimide substrate and thereby operated integrated light sources on a fully transparent and highly flexible optical probe.
• Keppeler D, Schwaerzle M, Harczos T, Bodensiek K, Jablonski L, Dieter A, Wolf B, Ayub S, Duque Afonso C, Wrobel C, Hoch G, Abdellatif K, Jeschke M, Rankovic V, Paul O, Ruther P, Moser T
  Multichannel optogenetic stimulation of the auditory pathway using microfabricated LED cochlear implants
  2020 Sci Transl Med, Band: 12, Seite: eabb8086
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  Kurzfassung

  When hearing fails, electrical cochlear implants (eCIs) provide the brain with auditory information. One important bottleneck of CIs is the poor spectral selectivity that results from the wide current spread from each of the electrode contacts. Optical CIs (oCIs) promise to make better use of the tonotopic order of spiral ganglion neurons (SGNs) inside the cochlea by spatially confined stimulation. Here, we established multichannel oCIs based on light-emitting diode (LED) arrays and used them for optical stimulation of channelrhodopsin (ChR)−expressing SGNs in rodents. Power-efficient blue LED chips were integrated onto microfabricated 15-µm-thin polyimide-based carriers comprising interconnecting lines to address individual LEDs by a stationary or mobile driver circuitry. We extensively characterized the optoelectronic, thermal, and mechanical properties of the oCIs and demonstrated stability over weeks in vitro. We then implanted the oCIs into ChR-expressing rats and gerbils, and characterized multichannel optogenetic SGN stimulation by electrophysiological and behavioral experiments. Improved spectral selectivity was directly demonstrated by recordings from the auditory midbrain. Long-term experiments in deafened ChR-expressing rats and in nontreated control animals demonstrated specificity of optogenetic stimulation. Behavioral studies on animals carrying a wireless oCI sound processor revealed auditory percepts. This study demonstrates hearing restoration with improved spectral selectivity by an LED-based multichannel oCI system.
  
  
   
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• Yanagisawa R, Tsujii N, Mori T, Ruther P, Paul O, Nomura M
  Nanostructured planar-type uni-leg Si thermoelectric generators
  2020 Appl Phys Express, Band: 13, Nummer: 9, Seite: 095001
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  Kurzfassung

  We demonstrate the power enhancement of planar-type uni-leg poly-Si thermoelectric generators by nano-patterning. The thermoelectric generators were fabricated on an SOI wafer by a conventional lithography-based process. The size of the phononic nano-patterning (300 nm in period) was designed based on the thermal phonon mean free path spectrum. The thermal conductivity of the Si membrane was reduced by 60% compared with an unpatterned one, which resulted in the doubled thermoelectric figure-of-merit. The nano-patterning increased the temperature gradient in the Si membrane and resulted in a four times higher voltage and ten times larger power density.
• Fiáth R, Meszéna D, Boda M, Barthó P, Ruther P, Ulbert I
  Recording site placement on planar silicon-based probes affects neural signal quality: edge sites enhance acute recording performance
  2020 bioRxiv
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  Kurzfassung

  Objective Multisite, silicon-based probes are widely used tools to record the electrical activity of neuronal populations. Several physical features of these devices (e.g. shank thickness, tip geometry) are designed to improve their recording performance. Here, our goal was to investigate whether the position of recording sites on the silicon shank might affect the quality of the recorded neural signal in acute experiments. Approach Neural recordings obtained with five different types of high-density, single-shank, planar silicon probes from anesthetized rats were analyzed. Wideband data were filtered (500 - 5000 Hz) to extract spiking activity, then various quantitative properties (e.g. amplitude distribution of the filtered potential, single unit yield) of the recorded cortical and thalamic activity were compared between sites located at different positions of the silicon shank, focusing particularly on edge and center sites. Main results Edge sites outperformed center sites: mean values of the examined properties of the spiking activity were in most cases higher for edge sites (~94%, 33/35) and a large fraction of these differences were also statistically significant (~45%, 15/33) with effect sizes ranging from small to large. Although the single unit yield was similar between site positions, the difference in signal quality was remarkable in the range corresponding to high-amplitude spikes. Furthermore, the advantage of edge sites slightly decreased for probes having a narrower shank. Significance The better signal quality on edge sites might be the result of the reduced shielding effect of the silicon shank providing a larger field of view for edge sites to detect spikes, or the less tissue damage caused near the edges of the shank. Our results might aid the design of novel neural implants in enhancing their recording performance by identifying more efficient recording site placements.
  
  
   
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• Beinert A J, Imm M, Benick J, Becker F, Seitz S, Heinrich M, Paul O, Glunz S. W., Aktaa J, Eitner U, Neuhaus H
  Silicon solar cell integrated stress and temperature sensors fro photovoltaic modules
  2020 Prog Photovoltaics, Seiten: 717 - 724
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  Kurzfassung

  We propose silicon solar cell–integrated stress and temperature sensors as a new approach for the stress and temperature measurement in photovoltaic (PV) modules. The solar cell–integrated sensors enable a direct and continuous in situ measurement of mechanical stress and temperature of solar cells within PV modules. In this work, we present a proof of concept for stress and temperature sensors on a silicon solar cell wafer. Both sensors were tested in a conventional PV module setup. For the stress sensor, a sensitivity of (−47.41 ± 0.14)%/GPa has been reached, and for the temperature sensor, a sensitivity of (3.557 ± 0.008) × 10−3 K−1 has been reached. These sensors can already be used in research for increased measurement accuracy of the temperature and the mechanical stress in PV modules because of the implementation at the precise location of the solar cells within a laminate stack, for process evaluation, in‐situ measurements in reliability tests, and the correlation with real exposure to climates.
  
  
   
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• Gundelach LA, Hüser MA, Beutner D, Ruther P, Bruegmann T
  Towards the clinical translation of optogenetic skeletal muscle stimulation
  2020 Pfluegers Archiv - European Journal of Physiology
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  Kurzfassung

  Paralysis is a frequent phenomenon in many diseases, and to date, only functional electrical stimulation (FES) mediated via the innervating nerve can be employed to restore skeletal muscle function in patients. Despite recent progress, FES has several technical limitations and significant side effects. Optogenetic stimulation has been proposed as an alternative, as it may circumvent some of the disadvantages of FES enabling cell type–specific, spatially and temporally precise stimulation of cells expressing light-gated ion channels, commonly Channelrhodopsin2. Two distinct approaches for the restoration of skeletal muscle function with optogenetics have been demonstrated: indirect optogenetic stimulation through the innervating nerve similar to FES and direct optogenetic stimulation of the skeletal muscle. Although both approaches show great promise, both have their limitations and there are several general hurdles that need to be overcome for their translation into clinics. These include successful gene transfer, sustained optogenetic protein expression, and the creation of optically active implantable devices. Herein, a comprehensive summary of the underlying mechanisms of electrical and optogenetic approaches is provided. With this knowledge inmind, we substantiate a detailed discussion of the advantages and limitations of each method. Furthermore, the obstacles in the way of clinical translation of optogenetic stimulation are discussed, and suggestions on how they could be overcome are provided. Finally, four specific examples of pathologies demanding novel therapeutic measures are discussed with a focus on the likelihood of direct versus indirect optogenetic stimulation.
  
  
   
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• Dieter A, Klein E, Keppeler D, Jablonski L, Harczos T, Hoch G, Rankovic V, Paul O, Jeschke M, Ruther P, Moser T
  µLED-based optical cochlear implants for spectrally selective activation of the auditory nerve
  2020 Embo Mol Med, Seite: e12387
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  Kurzfassung

  Electrical cochlear implants (eCIs) partially restore hearing and enable speech comprehension to more than half a million users, thereby re-connecting deaf patients to the auditory scene surrounding them. Yet, eCIs suffer from limited spectral selectivity, resulting from current spread around each electrode contact and causing poor speech recognition in the presence of background noise. Optogenetic stimulation of the auditory nerve might overcome this limitation as light can be conveniently confined in space. Here, we combined virusmediated optogenetic manipulation of cochlear spiral ganglion neurons (SGNs) and microsystems engineering to establish acute multi-channel optical cochlear implant (oCI) stimulation in adult Mongolian gerbils. oCIs based on 16 microscale thin-film lightemitting diodes (lLEDs) evoked tonotopic activation of the auditory pathway with high spectral selectivity and modest power requirements in hearing and deaf gerbils. These results prove the feasibility of lLEDbased oCIs for spectrally selective activation of the auditory nerve.
  
  
   
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2019

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• Meszéna D, Kerekes B A, Pál I, Orbán G, Fiáth R, Holzhammer T, Ruther R, Ulbert I, Márton G
  A silicon-based spiky probe providing improved cell accessibility during in vitro slice recordings
  2019 Sensors and Actuators B: Chemical, Band: 297, Seite: 126649
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  Kurzfassung

  Aims: In this study, we introduce an edge-type laminar silicon probe suitable for improved cell accessibility during in vitro brain slice recordings. With protruding contact sites, the spiky probe provides high signal yield and quality while approaching cells located deeper in the tissue. Methods. The spiky probe comprises an angled shank carrying 32 protruding contact sites with three possible spacing of 25 μm, 50 μm and 100 μm. The angled shank makes the probe compatible with large microscope objectives used typically in two-photon imaging, in vitro. Spiky probes were batch manufactured with high precision using the etching before grinding technology and bonded to a custom designed printed circuit board. A quantitative comparison of the performance was made against a commercially available surface probe. To investigate the long-term stability of contact sites, the spiky probe was repeatedly inserted in seven experiments (17 insertions, in total) using Wistar rat hippocampal slices, in vitro. Impedance magnitudes and phase angles were compared before and after the extensive usage. Results: Single unit activities were recorded with higher neuronal yield and higher amplitudes compared to the surface probe. Impedances did not increase significantly after reusing the probe in multiple experiments. Furthermore, we were able to detect extracellular action potentials from the same single unit on multiple, adjacent contact sites. Finally, we separated the recorded single units into putative cell types based on their extracellular waveforms. Conclusion and outlook: The spiky probes were proved to be optimal solutions to record extracellular spike waveforms, in vitro. The improved signal quality allowed us to distinguish between putative interneurons and principal cells. In future works, integrative experiments using these probes may provide multi-modal data for cellular electrophysiology resulting in a deeper understanding of single cell contributions to mass neural activity.
• Zgierski-Johnston C, Ayub S, Fernández M, Rog-Zielinska E, Barz F, Paul O, Kohl P, Ruther P
  Cardiac pacing using transmural multi-LED probes in channelrhodopsin-expressing mouse hearts
  2019 Progress in Biophysics and Molecular Biology
• Nomura M, Yanagisawa R, Zimmermann P, Ruther P, Paul O
  Design of Planar Si Thermoelectric Generators with Phononic Crystal Patterning
  2019 Sensor Mater, Band: 31, Nummer: 9, Seiten: 2803 - 2810
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  This paper presents the design and optimization of planar poly-Si thermoelectric generators (TEGs) for energy harvesting application. Temperature and electric potential distributions are simulated using material parameters, which were experimentally obtained from test structures, by the finite element method to evaluate the performance of TEGs. TEGs with unpatterned membranes or membranes with phononic crystal (PnC) nanostructures are investigated to evaluate the increase in power density by nanopatterning. The power density is increased by PnC nanopatterning with larger holes and the optimal bridge length decreases owing to a higher thermal resistance. The series of simulations shows that nanopatterning increases the power density 2.5 times at a smaller bridge length and is also advantageous from the viewpoint of mechanical strength.
• Fiath R, Raducanu BC, Musa S, Andrei A, Lopez CM, Welkenhuysen M, Ruther P, Aarts A, Ulbert I
  Fine-scale mapping of cortical laminar activity during sleep slow oscillations using high-density linear silicon probes
  2019 J Neurosci Meth, Band: 316, Seiten: 58 - 70
• Klein E, Gossler C, Paul O, Schwarz U T, Ruther P
  High-yield indium-based wafer bonding for large-area multi-pixel optoelectronic probes for neuroscientific research
  2019 J Micromech Microeng, Band: 29, Seiten: 095006 - 095015
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  This paper reports on the optimization of wafer-scale bonding of micro-light-emitting diodes (µLEDs) on four-inch sapphire wafers onto silicon (Si) substrates using an indium–gold (In–Au) reflow process. The bonding yield was optimized from initial values below 10% to 100% by applying a systematic variation of the two most relevant bonding parameters, namely the indium (In) bonding pad height t 2 and the relative bonding area Q. The fabrication process is designed to reliably transfer mLEDs from sapphire to Si substrates. The process is demonstrated by realizing optoelectronic probes carrying arrays of mLEDs dedicated for applications in neuroscientific research applying optogenetic methods. The 6 m thick mLEDs comprise of a gallium nitride layer epitaxially grown on sapphire wafers and lithographically patterned into mLEDs with lateral dimensions down to using reactive ion etching. The mLEDs are transferred onto Si substrates carrying interconnecting tracks and bonding pads made of gold (Au). Two technological challenges were successfully addressed. The first is to pattern thick In layers with lateral dimensions down to on top of the 6 m high mLED mesas. The second results from residual thermomechanical stress after wafer bonding due to the thermal expansion mismatch of sapphire and Si. It is demonstrated that the stress induced rupture of the In–Au bond interface between sapphire and Si is completely suppressed for t 2, Q combinations with m and . These results enable fully functional two-dimensional arrays with mLEDs to be realized on 65 m thin Si substrates.
• Chauvière L, Pothof F, Gansel K S, Klon-Lipok J, Aarts A A A, Holzhammer T, Paul O, Singer J W, Ruther P
  In vivo recording quality mechanically decoupled floating versus skull-fixed silicon-based neural probes
  2019 Front Neurosci-switz, Band: 13
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  Kurzfassung

  Throughout the past decade, silicon-based neural probes have become a driving force in neural engineering. Such probes comprise sophisticated, integrated CMOS electronics which provide a large number of recording sites along slender probe shanks. Using such neural probes in a chronic setting often requires them to be mechanically anchored with respect to the skull. However, any relative motion between brain and implant causes recording instabilities and tissue responses such as glial scarring, thereby shielding recordable neurons from the recording sites integrated on the probe and thus decreasing the signal quality. In the current work, we present a comparison of results obtained using mechanically fixed and floating silicon neural probes chronically implanted into the cortex of a non-human primate. We demonstrate that the neural signal quality estimated by the quality of the spiking and local field potential (LFP) recordings over time is initially superior for the floating probe compared to the fixed device. Nonetheless, the skull-fixed probe also allowed long-term recording of multi-unit activity (MUA) and low frequency signals over several months, especially once pulsations of the brain were properly controlled.
• Takeuchi K, Takama N, Kim B, Sharma K, Paul O, Ruther P
  Microfluidic chip to interface porous microneedles for ISF collection
  2019 Biomed Microdevices, Band: 21, Nummer: 28

2018

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• Fiath R, Raducanu B C, Musa S, Andrei A, Lopez C M, van Hoof C, Ruther P, Aarts A, Horvath D, Ulbert I
  A silicon-based neural probe with densely-packed low-impedance titanium nitride microelectrodes for ultrahigh-resolution in vivo recordings
  2018 Biosens Bioelectron, Band: 106, Seiten: 86 - 92
• Heizmann S, Kilias A, Ruther P, Egert U, Asplund M
  Active Control of Dye Release for Neuronal Tracing Using PEDOT-PSS Coated Electrodes
  2018 IEEE T Neur Sys Reh, Band: 26, Seiten: 299 - 306
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  Kurzfassung

  Penetrating neural probes comprising arrays of microelectrodes are commonly used to monitor local field potentials and multi-unit activity in animal brain over time frames of weeks. To correlate these recorded signals to specific tissue areas, histological analysis is performed after the experimental endpoint. Even if the lesion of the penetrating probe shaft can be observed, a precise reconstruction of the exact electrode positions is still challenging. To overcome these experimental difficulties, we developed a new concept, whereupon recording electrodes are coated with a poly (3, 4-ethylenedioxythiophene/ polystyrenesulfonate) (PEDOT/PSS)-based film. The conducting polymer acts as dye reservoir over several weeks and afterwards provides controlled delivery of neurotracers. This paper presents a recording electrode based on a PEDOT/PSS bilayer optimized for dye delivery and with reduced impedance. Controlled exchange of neurotracer dye is successfully demonstrated in vitro using spectrofluorometry and in neuroblastoma cell cultures. A second PEDOT/PSS capping layer on top of the dye reservoir lowers the passive leakage of dye by a factor of 6.4 and prevents a direct contact of the dye filled layer with the cells. Stability tests over four weeks demonstrate the electrochemical stability of the PEDOT coating, as well as retained functionality of the dye delivery system.
• Sayed Herbawi A, Christ O, Kiessner L, Mottahi S, Hofmann U G, Paul O, Ruther P
  CMOS Neural Probe with 1600 Close-packed Recording Sites and 32 Analog Output Channels
  2018 J Microelectromech S
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  This paper reports on 1 the development, characterization, and validation of neural probes serving the growing need of neuroscience for miniaturized tools enabling simultaneous high-resolution recording of neural activity in multiple brain areas. The probes consist of a needle-shaped shaft with a crosssection of 100 × 50 μm2 and a length of 10 or 5 mm emerging from a base with dimensions of only 0.55×1.8 mm2. The shafts carry 1600 and 800 recording sites, respectively, grouped into 50 (respectively 25) blocks of 4 × 8 electrodes with an area of 17 × 17 μm2 each, a pitch of 20 μm, and an electrode-to electrode spacing of 3 μm. The probes are fabricated using a commercial 0.18 μm CMOS process followed by dedicated metallization, passivation, and microfabrication steps. Neural signals are accessible through 32 analog output channels via a hierarchical digital addressing scheme implementing an advanced electronic depth control concept giving the option of multiple scanning modes and offering a switching time of 416 μs at a clock frequency of 1 MHz. All output channels are shielded against each other, whereby crosstalk between neighboring channels is measured to be −58 dB at 1 kHz. Absolute impedance values at 1 kHz of single IrOx and Pt electrodes are 230 ± 38 kOhm and 2.2 ± 0.3 MOhm, respectively. In vivo recordings taking advantage of the new addressing concept for high-resolution recordings from multiple brain regions were successfully performed in anesthetized rats.
• Hoch K, Pothof F, Becker F, Paul O, Ruther P
  Development, Modeling, Fabrication, and Characterization of a Magnetic, Micro-Spring-Suspended System for the Safe Electrical Interconnection of Neural Implants
  2018 Micromachines-basel, Band: 9, Nummer: 9, Ergänzungsband: 424, Seiten: 1 - 19
• Klein E, Gossler C, Paul O, Ruther P
  High-density mLED-based otpical cochlear implant with improved thermomechanical behavior
  2018 Front Neurosci-switz, Band: 12, Seiten: 659 - 659
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  Kurzfassung

  This study reports the realization of an optical cochlear implant (oCI) with optimized thermomechanical properties for optogenetic experiments. The oCI probe comprises 144 miniaturized light-emitting diodes (μLEDs) distributed along a bendable, 1.5-cm-long, 350-μm-wide and 26-μm-thick probe shaft, individually controlled via a n × p matrix interconnection. In contrast to our earlier approach based on polyimide (PI) and epoxy resin with different thermal expansion coefficients, the μLEDs and interconnecting wires are now embedded into a triple-layer stack of a single, biocompatible, and highly transparent epoxy material. The new material combination results in a pronounced reduction of thermomechanical bending in comparison with the material pair of the earlier approach. We developed a spin-coating process enabling epoxy resin layers down to 5 μm at thickness variations of less than 7% across the entire carrier wafer. We observed that the cross-linking of epoxy resin layers strongly depends on the spin-coating parameters which were found to be correlated to a potential separation of epoxy resin components of different densities. Furthermore, various metallization layers and corresponding adhesion promoting layers were investigated. We identified the combination of silicon carbide with a titanium-based metallization to provide the highest peeling strength, achieving an adhesion to epoxy improved by a factor of two. In order to obtain a high process yield, we established a stress-free implant release using the electrochemical dissolution of a sacrificial aluminum layer. The direct comparison of oCI probe variants using a single epoxy material and the combination of PI and epoxy resin revealed that the epoxy-resin-only probe shows minimal thermomechanical probe bending with a negligible hysteresis. The thermal probe characterization demonstrated that the temperature increase is limited to 1 K at μLED DC currents of up to 10 mA depending on the stimulation duration and the medium surrounding the probe. The optical output power and peak wavelengths of the new oCI variant were extracted to be 0.82 mW and 462 nm when operating the μLEDs at 10 mA, 10 kHz, and a duty cycle of 10%. The optical power corresponds to a radiant emittance of 407 mW/mm2, sufficient for optogenetic experiments using channelrhodopsin-2.
• Fiath R, Hofer K T, Csikos V, Horvath D, Nanasi T, Toth K, Pothof F, Böhler C, Asplund M, Ruther P, Ulbert I
  Long-term recording performance and biocompatibility of chronically implanted cylindrically-shaped, polymer-based neural interfaces
  2018 Biomed Eng Online, Seiten: 301 - 315
• Sileo L, Bitzenhofer S H, Spagnolo B, Pöpplau J A, Holzhammer T, Pisanello M, Pisano F, Bellistri E, Maglie E, De Vittorio M, Ruther P, Hanganu-Opatz I L, Pisanello F
  Tapered fibers combined with a multi-electrode array for optogenetics in mouse medial prefrontal cortex
  2018 Front Neurosci-switz, Band: 12, Ergänzungsband: e771
• Dimitriadis G, Neto J P, Aarts A, Alexandru A, Ballini M, Battaglia F, Calcaterra L, David F, Fiath R, Frazao J, Geerts J, Gentet L J, Van Helleputte N, Holzhammer T, van Hoof C, Horvath D, Lopes G, Maris E, Marques-Smith A, Marton G, Meszena D, Mitra S, Musa S, Neves H, Nogueira J, Orban G A, Pothof F, Putzeys J, Raducanu B, Ruther P, Schroeder T, Singer W, Tiesinga P, Ulbert I, Wang S, Welkenhuysen M, Kampff A R
  Why not record from every channel with a CMOS scanning probe?
  2018 bioRxiv

2017

 nach oben zur Jahresübersicht

• Schwärzle M, Paul O, Ruther P
  Compact Silicon-based Optrode with Integrated Laser Diode Chips, SU-8 Waveguides and Platinum Electrodes for Optogenetic Applications
  2017 J Micromech Microeng, Band: 27, Ergänzungsband: 065004
• Becker F, Paul O
  Efficient cross-sensitivity compensation in multisensor systems by half-blind calibration
  2017 Sensor Actuat A-phys, Band: 257, Seiten: 154 - 164
• Ayub S, Gentet L J, Fiath R, Schwärzle M, Borel M, David F, Barthó P, Ulbert I, Paul O, Ruther P
  Hybrid intracerebral probe with integrated bare LED chips for optogenetic studies
  2017 Biomed Microdevices
• Becker F, Jaeger R, Schmidt F, Lapatki B, Paul O
  Miniaturized six-degree-of-freedom force/moment transducers for instrumented teeth
  2017 Ieee Sens J, Band: 17, Nummer: 12, Seiten: 3644 - 3655
• Gullo M, Takeuchi S, Paul O
  Multicellular biohybrid materials: probing the interplay of cells of different types precisely positioned and contrained on 3D wireframe-like microstructures
  2017 Adv Healthc Mater, Band: 6, Seiten: 1601053 - 1601060
• D. Dinakaran, Goßler C, Mounir C, Paul O, Schwarz U, Ruther P
  Phosphor-based light conversion for miniaturized optical tools
  2017 Appl Optics, Band: 56, Nummer: 13, Seiten: 3654 - 3659
• Barz F, Livi A, Lanzilotto M, Maranesi M, Bonini L, Paul O, Ruther P
  Versatile, modular three-dimensional microelectrode arrays for neuronal ensemble recordings: from design to fabrication, assembly, and functional validation in non-human primates
  2017 J Neural Eng, Band: 14, Seite: 36010 pp

2016

 nach oben zur Jahresübersicht

• Heizmann S, Kilias A, Ruther P, Egert U, Asplund M
  Active control of dye release for neuronal tracing using PEDOT-PSS coated electrodes
  2016 Ieee T Neur Sys Reh, Band: 2015, Nummer: 313, Seiten: 1 - 9
• Stieglitz T, Paul O, Wallrabe U, Ruther P
  BrainLinks-BrainTools - Methods and tools for neural engineering
  2016 Biomed Tech, Band: 61, Seite: 234
• Pothof F, Bonini L, Lanzilotto M, Livi A, Fogassi L, Orban G A, Paul O, Ruther P
  Chronic neural probe for simultaneous recording of single-unit, multi-unit, and local field potential activity from multiple brain sites
  2016 Journal Of Neural Engineering, Band: 13, Ergänzungsband: 046006, Seite: 13
• Moser D, Müller D, Paul O
  Compact test structure to measure all thermophysical properties for the in-plane figure of merit ZT of thin films
  2016 J Electron Mater, Band: 45, Nummer: 11, Seiten: 5507 - 5513
• Sander C, Leube C, Paul O
  Compact two-dimensional CMOS Hall sensor based on switchable configurations of four three-contact elements
  2016 Sensors and Actuators A-physical, Band: 248, Seiten: 281 - 289
• Pothof F, Sharma K, Paul O, Ruther P
  Cost-effective, high-channel-count system for impedance spectroscopy
  2016 Biomed J, Band: 61, Seite: 241
• Stieglitz T, Fiedler E, Vasjari D A, Bentler C, Liljemalm R, Pothof F, Sayed Herbawi A, Barz F, Kuhl M, Paul O, Ruther P
  Developments for the next generation of brain probes
  2016 Biomed J, Band: 61, Seite: 237
• Lanzilotto M, Livil A, Maranesi M, Gerbella M, Barz F, Ruther P, Fogassi L, Rizzolatti G, Bonini L
  Extending the cortical grasping network: Presupplementary motor neuron activity during vision and grasping of objects
  2016 Cereb Cortex, Band: 26, Seiten: 4435 - 4449
• Sander C, Vecchi M, Cornils M, Paul O
  From Three-Contact Vertical Hall Elements to Symmetrized VerticalHall Sensors with Low Offset
  2016 Sensor Actuat A-phys, Nummer: 240, Seiten: 92 - 102
• Michon F, Aarts A, Holzhammer T, Ruther P, Borghs G, McNaughton B, Kloosterman F
  Integration of silicon-based neural probes and micro-drive arrays for chronic recording of large populations of neurons in behaving animals
  2016 J Neural Eng, Band: 13, Seite: 46018
• Fiath R, Beregszászi P, Horváth D, Aarts A, Ruther P, Neves H, Bokor H, Acsády L, Ulbert I
  Large-scale recording of thalamocortical circuits: in vivo electrophysiology with the two-dimensional electronic depth control silicon probe
  2016 J Neurophysiol
• Alt M T, Fiedler E, Rudmann L, Ordonez J, Ruther P, Stieglitz T
  Let There Be Light - Optoprobes for Neural Implants
  2016 Proceedings IEEE
• Ruther P, Alt M, Fiedler E, Rudmann L, Schwärzle M, Paul O, Stieglitz T
  MEMS-based micro-optical tools for optogenetic applications
  2016 Biomed J, Band: 61, Seite: 236
• Sander C, Leube C, Aftab T, Ruther P, Paul O
  Monolithic isotropic 3D silicon hall sensor
  2016 Sensors and Actuators A-physical, Band: 247, Seiten: 587 - 597
• Moritz C, Ruther P, Goering S, Statt A, Ball T, Burgard W, Chudler E, Rao R
  New Perspectives on Neuroengineering and Neurotechnologies: NSF-DFG Workshop Report
  2016 Ieee T Bio-med Eng, Band: 63, Nummer: 7, Seiten: 1354 - 1367

2015

 nach oben zur Jahresübersicht

• Nomura M, Kage Y, Müller D, Moser D, Paul O
  Electrical and thermal properties of polycrystalline Si thin films with phononic crystal nanopatterning for thermoelectric applications
  2015 Appl Phys Lett, Band: 106, Nummer: 223, Ergänzungsband: 106, Seiten: 1 - 4
• Nomura M, Kage Y, Nakagawa J, Hori T, Maire J, Shiomi J, Anufriev R, Moser D, Paul O
  Impeded thermal transport in Si multiscale hierarchical architectures with phononic crystal nanostructures
  2015 Phys Rev B, Band: 91, Nummer: 205, Ergänzungsband: 422, Seiten: 1 - 6
• Larramendy F, Blatche M.C., Mazenq L, Laborde A, Temple-Boyer P, Paul O
  Microchannel-connected SU-8 honeycombs by single-step projection photolithography for positioning cells on silicon oxide nanopillar arrays
  2015 J Micromech Microeng, Band: 25, Seiten: 1 - 9
• Ruther P, Paul O
  New approaches for CMOS-based devices for large-scale neural recording
  2015 ScienceDirect, Band: 32, Seiten: 31 - 37
• Nomura M, Nakagawa J, Kage Y, Maire J, Moser D, Paul O
  Thermal phonon transport in silicon nanowires and two-dimensional phononic crystal nanostructures
  2015 Appl Phys Lett, Band: 106, Nummer: 143, Ergänzungsband: 102, Seiten: 1 - 4

2014

 nach oben zur Jahresübersicht

• Bonini L, Maranesi M, Livi A, Bruni S, Fogassi L, Holzhammer T, Paul O, Ruther P
  Application of floating silicon-based linear multielectrode aarays for acute recording of single neuron activity in awake behaving monkeys
  2014 Biomed Tech, Band: 59(4), Seiten: 273 - 281
• Spieth S, Schumacher A, Trenkle F, Brett O, Seidl K, Herwik S, Kisban S, Ruther P, Paul O, Aarts A.A.A, Neves H.P., Rich P.D., Theobald D.E., Holztman T, Dalley J.W., Verhoef B-E, Janssen P, Zengerle R
  Approaches for drug delivery with intracortical probes
  2014 Biomed Tech, Band: 59(4), Seiten: 291 - 303
• Vittoriosi A, Brandner J J, Ruther P, Paul O, Dittmeyer R
  Design and Characterization of Integrated Microsensors for Heat Transfer Studies in Microchannels
  2014 Exp Heat Transfer, Band: 27, Seiten: 389 - 402
• Gossler C, Bierbrauer C, Moser R, Kunzer M, Holc K, Pletschen W, Köhler K, Wagner J, Schwärzle M, Ruther P, Paul O, Neef J, Keppeler D, Hoch G, Moser T, Schwarz U
  GaN-based micro-LED arrays on flexible substrates for optical cochlear implants
  2014 J Phys D Appl Phys, Band: 47, Ergänzungsband: 205401, Seiten: 1 - 6
• Dombovari B, Fiath R, Kerekes B.P., Toth E, Wittner L, Horvath D, Seidl K, Herwik S, Torfs T, Paul O, Ruther P, Neves H, Ulbert I
  In vivo validation of the electronic depth control probes
  2014 Biomed Tech, Band: 59(4), Seiten: 283 - 289
• Chow W.W.Y., Herwik S, Kisban S, Ruther P, Neves H, Oscarsson S, Göthelid E
  Influence of bio-coatings on the recording performance of neural electrodes
  2014 Biomed Tech, Band: 59(4), Seiten: 315 - 322
• Stieglitz T, Neves H, Ruther P
  Neural probes - microsystems to interface with the brain
  2014 Biomed Tech, Band: 59(4), Seiten: 269 - 271
• Donelly N.A., Holtzman T, Rich P.D., Nevado-Holgado A.J., Fernando A.B.P., Van Dijck G, Holzhammer T, Paul O, Ruther P, Ruther P, Paulsen O, Robbins T.W., Dalley J.W.
  Oscillatory activity in the medial prefrontal cortex and nucleus accumbens correlates with impulsivity and reward outcome
  2014 Plos One, Band: 9, Nummer: 10, Ergänzungsband: e111300

2013

 nach oben zur Jahresübersicht

• Le Huy V, Kamiya S, Nagayoshi K, Izumi H, Gaspar J, Paul O
  A prediction scheme of the static fracture strength of MEMS structures based on the characterization of damage distribution on a processed surface
  2013 J Micromech Microeng, Band: 23, Ergänzungsband: 045008, Seiten: 1 - 10
• Kuhl M, Gieschke P, Rossbach D, Hilzensauer S, Panchaphongsaphak T, Ruther P, Lapatki B, Paul O, Manoli Y
  A wireless stress mapping system for orthodontic brackets using CMOS integrated sensors
  2013 Ieee J Solid-st Circ, Band: 48, Nummer: 9, Seiten: 2191 - 2202
• Calixto R, Salamat B, Rode T, Hartmann T, Volckaerts B, Ruther P, Lenarz T, Lim H
  Investigation of a new electrode array technoogy for a central auditory prosthesis
  2013 Plos One, Band: 8, Nummer: 12, Ergänzungsband: e82148
• Huber S, Schott C, Paul O
  Package stress monitor to compensate for the piezo-hall effect in CMOS hall sensors
  2013 Ieee Sens J, Band: 13, Nummer: 8, Ergänzungsband: 2013, Seiten: 2890 - 2898
• Lemke B, Baumann M, Gieschke P, Baskaran R, Paul O
  Piezoresistive CMOS-compatible sensor for out-of-plane shear stress
  2013 Sensor Actuat A-phys, Band: 189, Seiten: 488 - 495

2012

 nach oben zur Jahresübersicht

• Kaufmann T, Vecchi M C, Ruther P, Paul O
  A computationally efficient numerical model of the offset of CMOS-integrated vertical Hall devices
  2012 Sensor Actuat A-phys, Band: 178, Seiten: 1 - 9
• Paul O, Raz R, Kaufmann T
  Analysis of the offset of semiconductor vertical Hall devices
  2012 Sensor Actuat A-phys, Band: 174, Seiten: 24 - 32
• Chow W W Y, Herwik S, Ruther P, Goethelid E, Oscarsson S
  Bio-polymer coatings on neural probe surfaces: Influence of the initial sample composition
  2012 Appl Surf Sci, Band: 258, Seiten: 7864 - 7871
• Seidl K, Schwärzle M, Ulbert I, Neves H P, Paul O, Ruther P
  CMOS-based high-density silicon microprobe arrays for electronic depth control in intracortical neural recording–characterization and application
  2012 J Microelectromech S, Band: 21, Nummer: 6, Seiten: 1426 - 1435
• van Dijck G, Seidl K, Paul O, Ruther P, van Hulle M, Reinoud M
  Enhancing the Yield of High-Density Electrode Arrays Through Automated electrode Selection
  2012 Int J Neural Syst, Band: 22, Nummer: 1, Seiten: 1 - 19
• Gaspar J, Gualdino A, Lemke B, Paul O, Chu V, Conde J P
  Mechanical and piezoresistive properties of thin silicon films deposited by plasma-enhanced chemical vapor deposition and hot-wire chemical vapor deposition at low substrate temperatures
  2012 J Appl Phys, Band: 112, Ergänzungsband: 024906, Seiten: 1 - 8
• Alan T, Yokosawa T, Gaspar J, Pandraud G, Paul O, Creemer F, Sarro P M, Zandbergen H W
  Micro-fabricated channel with ultra-thin yet ultra-strong windows enables electron microscopy under 4-bar pressure
  2012 Appl Phys Lett, Band: 100, Ergänzungsband: 081903, Seiten: 1 - 4
• Lemke B, Baskaran R, Paul O
  Piezoresistive CMOS sensor for out-of-plane normal stress
  2012 Sensor Actuat A-phys, Band: 176, Seiten: 10 - 18
• Le Huy V, Kamiya S, Gaspar J, Paul O
  Statistical Characterization of Fracture Strength and Fatigue Lifetime of Polysilicon Thin Films with Different Stress Concentration Fields
  2012 Journal of Solid Mechanics and Materials Engineering, Band: 6, Nummer: 11, Seiten: 1013 - 1029
• Le Huy V, Gaspar J, Paul O, Kamiya S
  Statistical characterization of fatigue lifetime of polysilicon thin films
  2012 Sensor Actuat A-phys, Band: 179, Seiten: 251 - 262
• Martin T, Gengenbach U, Guth H, Ruther P, Paul O, Bretthauer G
  silicon linkage with novel compliant mechanism for piezoelectric actuation of an intraocular implant
  2012 Sensor Actuat A-phys, Nummer: 188, Seiten: 335 - 341

2011

 nach oben zur Jahresübersicht

• Stephan J, Pagounis E, Laufenberg M, Paul O, Ruther P
  A Novel Concept for Strain Sensing Based on the Ferromagnetic Shape Memory Alloy NiMnGa
  2011 Ieee Sens J, Band: 11, Nummer: 11, Seiten: 2683 - 2689
• D. Fan, D. Rich, T. Holtzman, P. Ruther, J.W. Dalley, A. Lopez, M.A. Rossi, J.W. Barter, D. Salas-Meza, S. Herwik, T. Holzhammer, J. Morizio, H.H. Yin
  A Wireless Multi-Channel Recording System for Freely Behaving Mice and Rats
  2011 Plos One, Band: 6, Nummer: 7, Ergänzungsband: e22033, Seiten: 1 - 9
• S. Spieth, O. Brett, K. Seidl, A.A.A. Aarts, M.A. Erismis, S. Herwik, F. Trenkle, S. Tätzner, J. Auber, M. Daub, H.P. Neves, R. Puers, O. Paul, P. Ruther, R. Zengerle
  A floating 3D silicon microprobe array for neural drug delivery compatible with electrical recording
  2011 J Micromech Microeng, Band: 21, Seiten: 125001 - 125017
• S. Rues, B. Panchaphongsaphak, P. Gieschke, O. Paul, B.G. Lapatki
  An analysis of the measurement principle of smart brackets for 3D force and moment monitoring in orthodontics
  2011 J Biomech, Band: 04, Nummer: 029
• O. Frey, P.D. van der Wal, S. Spieth, O. Brett, K. Seidl, O. Paul, P. Ruther, R. Zengerle, N.F. de Rooij
  Biosensor microprobes with integrated microfluidic channels for bi-directional neurochemical interaction
  2011 J Neural Eng, Band: 8, Seiten: 66001 - 66010
• K. Seidl, S. Herwik, T. Torfs, H.P. Neves, O. Paul, P. Ruther
  CMOS-based high-density silicon micro probe arrays for electronic depth control in intracortical neural recording
  2011 J Microelectromech S, Band: 20, Nummer: 6, Seiten: 1439 - 1448
• R.P. von Metzen, N. Lass, P. Ruther, T. Stieglitz
  Diffusion-Limited Deposition of Parylene C
  2011 J Microelectromech S (Journal of Microelectromechanical Systems 2011, Band: 20, Nummer: 1, Seiten: 239 - 250
• B. Lemke, R. Baskaran, S. Ganapathysubramanian, O. Paul
  Experimental Determination of Stress Distributions Under Electroless Nickel Bumps and Correlation to Numerical Models
  2011 Ieee Sens J, Band: 11, Nummer: 11, Seiten: 2711 - 2717
• Friedmann A, Cismak A, Tautorat C, Koester P J, Baumann W, Held J, Gaspar J, Ruther P, Paul O, Heilmann A
  FIB preparation and SEM investigations for three-dimensional analysis of cell cultures on microneedle arrays
  2011 Scanning, Band: 33, Seiten: 1 - 9
• G.C. Pedrini, J. Gaspar, M.E. Schmidt, I. Alekssenko, O. Paul, W. Osten
  Measurement of nano/micro out-of-plane and in-plane displacements of micromechanical components by using digital holography and speckle interferometry
  2011 Opt Eng, Band: 50, Nummer: 10, Seite: 101504
• A. Menzel, K. Subannajui, F. Güder, D. Moser, O. Paul, M. Zacharias
  Multifunctional ZnO-Nanowire-Based Sensor
  2011 Adv Funct Mater, Band: 20, Seiten: 1 - 7
• Kaufmann T, Kopp D, Purkl F, Baumann M, Ruther P, Paul O
  Piezoresistive Response of Vertical Hall Devices
  2011 Ieee Sens J, Band: 11, Nummer: 11, Seiten: 2628 - 2635
• Sbierski B, Gieschke P, Paul O
  Shear Piezoresistance in MOSFET Devices Under General Operating Conditions
  2011 Ieee T Electron Dev, Band: 58, Nummer: 12, Seiten: 4145 - 4154
• P. Alpuim, J. Gaspar, P. Gieschke, C. Ehling, J. Kistner, N.J. Goncalves, M.I. Vasilevskiy, O. Paul
  Study of the piezoresistivity of doped nanocrystalline silicon thin films
  2011 J Appl Phys, Band: 109, Seiten: 123717-1 - 123717-9
• M. Herrmann, P. Gieschke, P. Ruther, O. Paul
  Torsional bridge setup for the characterization of integrated circuits and micro sensors under mechanical shear stress
  2011 Rev Sci Instrum, Band: 82, Seite: 125002
• Torfs T, Aarts A, Erismis M, Aslam J, Yazicioglu R, Seidl K, Herwik S, Ulbert I, Dombovari B, Fiath R, Kerekes B, Puers R, Paul O, Ruther P, Van Hoof C, Neves H
  Two-Dimensional Multi-Channel Neural Probes with Electronic Depth Control
  2011 BioCAS, Band: 5, Seiten: 403 - 412
• S. Herwik, O. Paul, P. Ruther
  Ultrathin Silicon Chips of Arbitrary Shape by Etching Before Grinding
  2011 J Microelectromech S, Band: 20, Nummer: 4, Seiten: 791 - 793

2010

 nach oben zur Jahresübersicht

• C. Hassler, R. von Metzen, P. Ruther, T. Stieglitz
  Characterization of Parylene C as an Encapsulation Material for Implanted Neural Prostheses
  2010 Wiley InterScience, Seiten: 266 - 274
• K. Seidl, T. Torfs, P.A. de Maizière, G. van Dijck, R. Csercsa, B. Dombovari, Y. Nurcahyo, H. Ramirez, M.M. van Hulle, G.A. Orban, O. Paul, I. Ulbert, H. Neves, P. Ruther
  Control and data acuqisition software for high-density CMOS-based microprobe arrays implementing electronic depth control
  2010 Biomed Tech, Seiten: 183 - 191
• J. Held, J. Gaspar, P. Ruther, M. Hagner, A. Cismak, A. Heilmann, O. Paul
  Design of experiment characterization of microneedle fabrication processes based on dry silicon etching
  2010 J. Micromech Microeng 2010, Seiten: 1 - 11
• M. Cornils, A. Rottmann, O. Paul
  How to Extract the Sheet Resistance and Hall Mobility from Arbitrarily Shaped Planar Four-Terminal Devices with Extended Contacts
  2010 Ieee T Electron Dev, Seiten: 2087 - 2097
• K. Seidl, S. Spieth, S. Herwik, J. Steigert, R. Zengerle, O. Paul. P. Ruther
  In-Plane silicon probes for simultaneous neural recording and drug delivery
  2010 J. Micromech Microeng 2010, no. 105006, Seiten: 1 - 11
• U. Bartsch, J. Gaspar, O. Paul
  Low-frequency two-dimensional resonators for vibrational micro energy harvesting
  2010 J Micromech Microeng, Seiten: 1 - 12
• S. Brugger, O. Paul
  Magnetic field amplification by slender cuboid-shaped magnetic concentrators with a single gap
  2010 Sensor Actuat A-phys, Seiten: 135 - 139
• J. Gaspar, O. Paul, V. Chu, J.P. Conde
  Mechanical properties of thin silicon films deposited at low temperatures by PECVD
  2010 J Micromech Microeng, Seiten: 1 - 6
• P. Ruther, S. Herwik, S. Kisban, K. Seidl, O. Paul
  Recent Progress in Neural Probes Using Silicon MEMS Technology
  2010 Ieej T Electr Electr, Band: 5, Seiten: 505 - 515
• L. Grand, L. Wittner, S. Herwik. E. Göthelid, P. Ruther, S. Oscarsson, H. Neves, B. Dombovári, R. Csercsa, G. Karmos, I. Ulbert
  Short and Long Term Biocompatibility of NeuroProbes Silicon Probes
  2010 J. Neurosci Meth, Nummer: 189, Seiten: 216 - 229

2009

 nach oben zur Jahresübersicht

• T. Stieglitz, B. Rubehn, C. Henle, S. Kisban, S. Herwik, P. Ruther, M. Schuettler
  Brain-computer interfaces: an overview of the hardware to record neural signals from the cortex
  2009 Prog Brain Res, Band: 175, Seiten: 297 - 315
• G. Pedrini, J. Gaspar, T. Wu, W. Osten, O. Paul
  Calibration of optical systems for the measurement of microcomponents
  2009 Opt Laser Eng, Seiten: 203 - 210
• G. Pedrini, J. Gaspar, W. Osten, O. Paul
  Development of Reference Standards for the Calibration of Optical Systems Used in the Measurement of Microcomponents
  2009 The Author
• O. Paul, M. Cornils
  Explicit connection between sample geometry and Hall response
  2009 Appl Phys Lett, Band: 95, Seite: 1-3
• S. Herwik, S. Kisban, A.A.A. Aarts, K. Seidl, G. Girardeau, K. Benchenane, M.B. Zugaro, S.I. Wiener, O. Paul, H.P. Neves, P. Ruther
  Fabrication technology for silicon-based microprobe arrays used in acute and sub-chronic neural recording
  2009 J Micromech Microeng, Band: 19, Seite: 074008
• J. Kern, S. Loeckermann, A. Fritsch, I. Hausser, W. Roth, T. Magin, C. Mack, M. Müller, O. Paul, P. Ruther, L. Bruckner-Tuderman
  Mechanisms of fibroblast cell therapy for dystrophic epidermolysis bullosa: High stability of collagen VII favors logn-term skin integrity
  2009 The American Society of Gene & Cell Therapy / Molecular Therapy
• J. Gaspar, M. Schmidt, J. Held, O. Paul
  Wafer-Scale Microtensile Testing of Thin Films
  2009 J Microelectromech S, Band: 18, Nummer: 5, Seiten: 1062 - 1076

2008

 nach oben zur Jahresübersicht

• J. Yang, J. Gaspar, O. Paul
  Fracture Properties of LPCVD Silicon Nitride and Thermally Grown Silicon Oxide Thin Films From the Load-Deflection of Long Si3N4 ans SiO/Si3N4 Diaphragms
  2008 J Microelectromech S, Band: 17, Seiten: 1120 - 1134
• P. Ruther, M. Wandt
  Innovativer miniaturisierter 3D-Kraftsensor für Koordinatenmesssysteme von Mikrokomponenten
  2008 Sensor Magazin, Seiten: 30 - 33
• O. Paul, P. Ruther
  Microneedle Electrodes for Measuring Potentials in Biology and Medicine
  2008 mst news, Nummer: 6, Seiten: 12 - 12
• M. Cornils, O. Paul
  Reverse-magnetic-field reciprocity in conductive samples with extended contacts
  2008 J Appl Phys, Band: 104, Nummer: 0245, Seiten: 1 - 7
• S. Kamiya, S. Amaki, T. Kawai, N. Honda, P. Ruther, J. Gaspar, O. Paul
  Seamless interpretation of the strength and fatigue lifetime of polycrystalline silicon thin films
  2008 J Micromech Microeng, Band: 18, Nummer: 9502, Seiten: 1 - 10
• M. Cornils, O. Paul
  Sheet resistance determination of electrically symmetric planar four-terminal devices with extended contacts
  2008 J Appl Phys, Band: 104, Ergänzungsband: 024503, Seiten: 1 - 10

2007

 nach oben zur Jahresübersicht

• Kamiya S, Kuypers, Trautmann A, Ruther P, Paul O
  Process Temperature Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure
  2007 J Microelectromech S
• M. Cornils, M. Dölle, O. Paul
  Sheet Resistance Determination Using Symmetric Structures With Contacts of Finite Size
  2007 Ieee T Electron Dev, Band: 54, Nummer: 10, Seiten: 2756 - 2761
• M. Dölle, J. Held, P. Ruther, O. Paul
  Simultaneous and Independent Measurement of Stress and Temperature Using a Single Field-Effect Transistor Structure
  2007 J Microelectromech S (Journal of Microelectromechanical Systems) 2007, Band: 15, Nummer: 5, Seiten: 1232 - 1242
• Lapatki BG, Bartholomeyczik J, Ruther P, Jonas IE, Paul O
  Smart Bracket for Multi-Dimensional Force and Moment Measurement.
  2007 J Dent Res, Band: 86, Nummer: 1, Seiten: 73 - 78
• B. Lapatki, O. Paul
  Smart Brackets for 3D-Force-Moment Measurements in Orthodontic Research and Therapy-Developmental Status and Prospects
  2007 J Orofac Orthop, Seiten: 377 - 396

2006

 nach oben zur Jahresübersicht

• Doelle M, Mager D, Ruther P, Paul O
  Geometry optimization for planar piezoresistive stress sensors based on the pseudo-Hall effect
  2006 Sensor Actuat A-phys, Band: 127, Seiten: 261 - 269
• Doelle M, Peters C, Ruther P, Paul O
  Piezo-FET stress sensor array for wire bonding characterization
  2006 J Microelectromech S, Band: 15, Nummer: 1, Seiten: 120 - 130
• Bartholomeyczik J, Doelle M, Ruther P, Paul O
  The continuous spinning current (CSC) stress sensor method for the extraction of two stress components in an offset compensated manner
  2006 Sensor Actuat A-phys, Band: 127, Seiten: 255 - 260

2005

 nach oben zur Jahresübersicht

• Jeyaprakash JD, Samuel S, Ruther P, Frerichs HP, Lehmann M, Paul O, RYhe J
  A Simple Route towards the Reduction of Surface Conductivity in Gas Sensor Devices
  2005 Sensor Actuat B-chem, Band: 110, Seiten: 218 - 224
• Schuster M, Klein N, Ruther P, Trautmann A, Paul O, Kuzel P, Kadlec F
  An interconnected 2D-TM EBG structure for millimeter and submillimeter waves
  2005 Ieee J Sel Area Comm, Band: 23, Nummer: 7, Seiten: 1378 - 1384
• J. Yang, O. Paul
  Fracture Properties of Thermal Silicon Oxide Thin Films From the Load-Deflection of Long SiNx/SiO2 Membranes
  2005 J Microelectromech S (Journal of Microelectromechanical Systems) 2005
• L. Samid, C. Peters, P. Ruther, O. Paul, Y. Manoli
  Low-Power Sensor Read-Out Circuits With Continuous Time Sigma-Delta Modulators
  2005 Analog 2005, Seiten: 151 - 155
• Ruther P, Bartholomeyczik J, Buhmann A, Trautmann A, Steffen K, Paul O
  Microelectromechanical HF resonators fabricated using a novel SOI-based low temperature process
  2005 Ieee Sens J, Band: 5, Nummer: 5, Seiten: 1112 - 1119
• J. Bartholomeyczik, S. Brugger, P. Ruther, O. Paul
  Multidimensional CMOS In-Plane Stress Sensor
  2005 IEEE Sens J (IEEE Sensors Journal) 2005, Band: 5, Nummer: 5, Seiten: 872 - 882
• Bartholomeyczik J, Ruther P, Paul O
  Multidimensional CMOS in-plane stress sensor
  2005 Ieee Sens J, Band: 5, Nummer: 5, Seiten: 872 - 882
• M. Dölle, C. Peters, P. Ruther, O. Paul
  Piezo-FET Stress Sensor Array for Wire Bonding Characterization
  2005 Microelectromech. Syst. (IEEE) 2005

2004

 nach oben zur Jahresübersicht

• O. Paul
  Dünnschicht-Materialdaten für die Mikrotechnik
  2004 VDI-Berichte, Band: 1829, Seiten: 423 - 432

2003

 nach oben zur Jahresübersicht

• P. Ruther, R. Janke, U. Schiller, O. Paul
  Thermomagnetic Residual Offset in Integrated Hall Plates
  2003 IEEE Sens J (IEEE Sensors Journal) 2003, Band: 3, Nummer: 6, Seiten: 693 - 699
• Ruther P, Buesser W, Janke R, Schiller U, Paul O
  Thermomagnetic residual offset in integrated Hall plates
  2003 Ieee Sens J, Band: 3, Nummer: 6, Seiten: 693 - 699

2002

 nach oben zur Jahresübersicht

• J. Yang, C. Peters, O. Paul
  Fracture Properties of LPCVD Silicon Nitride Thin Films From the Load-Deflection of Long Membranes
  2002 Sensor Acutat A-phys (Sensors and Actuators A-physical) 2002, Band: 97, Nummer: 98, Seiten: 520 - 526
• Yang Jinling, Peters C, Paul O
  Fracture Properties of LPCVD Silicon Nitride Thin Films from the Load-Deflection of Long Membranes
  2002 Sensor Actuat A-phys, Band: 97-98, Seiten: 520 - 526
• T. Kramer, O. Paul
  Postbuckled Micromachined Square Membranes Under Differential Pressure
  2002 J Micromech Microeng (Journal of Micromechanics and Microengineering) 2002, Band: 12, Seiten: 475 - 478
• Kramer T, Paul O
  Postbuckled Micromachined Square Membranes under Differential Pressure
  2002 J Micromech Microeng, Band: 12, Seiten: 475 - 478
• S. Hafizovic, O. Paul
  Temperature Dependent Thermal Conductivities of CMOS Layers by Micromachined Thermal van der Pauw Test Structures
  2002 Sensor Actuat A-phys (Sensors and Actuators A-physical) 2002, Band: 97, Nummer: 98, Seiten: 246 - 252
• Hafizovic S, Paul O
  Temperature Dependent Thermal Conductivities of CMOS Layers by Micromachined Thermal van der Pauw Test Structures
  2002 Sensor Actuat A-phys, Band: 97-98, Seiten: 246 - 252

2001

 nach oben zur Jahresübersicht

• Wagner U, Franz J, Schweiker M, Bernhard W, Müller-Fiedler R, Michel B, Paul O
  Mechanical Reliability of MEMS-Structures under Shock Load
  2001 Microelectron Reliab, Band: 41, Seiten: 1657 - 1662
• H. Nakajima, P. Ruther, J. Mohr, M. Tsugai, T. Usami
  Micro-Optical Distance Sensor Fabricated by Deep X-Ray Lithography
  2001 Opt Eng, Band: 40, Nummer: 8, Seiten: 1667 - 1673
• M. Ehmann, P. Ruther, M. von Arx, O. Paul
  Operation and Short-Term Drift of Polysilicon-Heated Microstructures at Temperatures up to 1200 K
  2001 J Micromech Microeng (Journal of Micromechanics and Microengineering) 2001, Band: 11, Seiten: 397 - 401
• Ehmann M, Ruther P, von Arx M, Paul O
  Operation and Short-Term Drift of Polysilicon-Heated Microstructures at Temperatures up to 1200 K
  2001 J Micromech Microeng, Band: 11, Seiten: 397 - 401
• T. Kramer, O. Paul
  Postbuckled Micromachined Square Thin Film Membranes under Differential Pressure
  2001 Materials Research Society, Band: 695, Seiten: 79 - 84
• T. Kramer, O. Paul
  Surface Micromachined Ring Test Structures to Determine Mechanical Properties of Compressive CMOS IC Thin Films
  2001 Sensor Actuat A-phys (Sensors and Actuators A-physical) 2001, Band: 92, Seiten: 292 - 298
• Kramer T, Paul O
  Surface Micromachined Ring Test Structures to Determine Mechanical Properties of Compressive CMOS IC Thin Films
  2001 Sensor Actuat A-phys, Band: 92, Seiten: 292 - 298
• A. Schaufelbühl, N. Schneeberger, U. Münch, M. Wälti, O. Paul, O. Brand, H. Baltes, C. Menolfi, Q. Huang, E. Döring, M. Läpfe
  Uncooled Low-Cost Thermal Imager Based on micromachined CMOS Integrated Sensor Array
  2001 J Microelectromech S, Band: 10, Seiten: 503 - 510
• Schaufelbuehl A, Schneeberger N, Münch U, Waelti M, Paul O, Brand O, Baltes H, Menolfi C, Huang Q, Doering E, Loepfe M
  Uncooled low-cost thermal imager based on micromachined CMOS integrated sensor array
  2001 IEEE/ASME J. Microelectromech. Syst., Band: 10, Seiten: 503 - 510

2000

 nach oben zur Jahresübersicht

• O. Paul, P. Ruther, L. Plattner, H. Baltes
  A Thermal von der Pauw Test Structure
  2000 Ieee T Semiconduct M, Band: 13, Nummer: 2, Seiten: 159 - 166
• M. von Arx, O. Paul, H. Baltes
  Process Dependent Thin Film Thermal Conductivity for Thermal CMOS MEMS
  2000 J Microelectromech S, Band: 9, Nummer: 1, Seiten: 136 - 145

1999

 nach oben zur Jahresübersicht

• D. Westberg, O. Paul, G.I. Andersson, H. Baltes
  A CMOS-Compatible Device for Fluid Density Measurements Fabricated by Sacrificial Aluminum Etching
  1999 Sensor Actuat A-phys, Band: 73, Seiten: 243 - 251
• O. Paul, H. Baltes
  Mechanical Behavior and Sound Generation Efficiency of Prestressed, Elastically Clamped and Thermomechanically Driven Thin Film Sandwiches
  1999 J Micromech Microeng, Band: 9, Seiten: 19 - 29
• P. Ruther, H. Nakajima, J. Mohr, St. Saenger
  Miniaturisierter Abstandssensor, hergestellt nach dem LIGA-Verfahren
  1999 Technisches Messen, Band: 66, Nummer: 5, Seiten: 176 - 184
• V. Ziebart, O. Paul, H. Baltes
  Strongly Buckled Square Micromachined Membranes
  1999 J Microelectromech S, Band: 8, Nummer: 4, Seiten: 423 - 432

1998

 nach oben zur Jahresübersicht

• M. Emmenegger, J. Korvink, M. Bächtold, M. von Arx, O. Paul, H. Baltes
  Application of Harmonic Finite Element Analysis to a CMOS Heat-Capacity Measurement Structure
  1998 Sensor Mater, Band: 10, Seiten: 405 - 412
• V. Ziebart, O. Paul, U. Münch, J. Schwizer, O. Paul, H. Baltes
  Mechanical Properties of Thin Films from the Load-Deflection of Long Clamped Plates
  1998 J Microelectromech S, Band: 7, Seiten: 320 - 328

Monographien

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2007

 nach oben zur Jahresübersicht

• Transactions on Electrical and Electronic Engineering, Seite: 17
  Adanced Silicon Microstructures, Sensors and Systems
  O. Paul, J. Gaspar, P. Ruther

2005

 nach oben zur Jahresübersicht

• Wiley-VCH
  Mikrosystemtechnik für Ingenieure
  Menz W, Mohr J, Paul O

2001

 nach oben zur Jahresübersicht

• Wiley-VCH
  Microsystem Technology
  Menz W, Mohr J, Paul O

Buchbeiträge

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2007

 nach oben zur Jahresübersicht

• O. Paul, J. Gaspar
  Thin-Film Characterization Using the Bulge Test
  In: Reliability of MEMS
  2007, Eds. Weinheim, Germany Wiley-VCH, Seiten: 67 - 121,

2006

 nach oben zur Jahresübersicht

• Paul O
  Microtransducer Operation
  In: MEMS – A Practical Guide to Design, Analysis and Applications
  2006, William Andrew Publishing / Springer-Verlag, J. G. Korvink and O. Paul, Seiten: 1 - 51, J. G. Korvink and O. Paul,

2005

 nach oben zur Jahresübersicht

• Paul O, Ruther P
  Material Characterization
  In: CMOS-based Micro and Nano Electro Mechanical Systems
  2005, Wiley-VCH, O. Brand and G. Fedder, Seiten: 69 - 135, O. Brand and G. Fedder,

2001

 nach oben zur Jahresübersicht

• W. Menz, J. Mohr, O. Paul
  Microsystem Technology
  In: Microsystem Technology
  2001, Wiley-VCH, ISBN: 3-527-29634-4

Vorträge

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2020

 nach oben zur Jahresübersicht

• Ruther P
  LED-based optogenetic tools - Thin-film LEDs vs LED chips
  2020 Bionics Institute Melbourne, Melbourbe, Australia; Remote seminar talk
• Ruther P, Ayub S, Klein E, Sharma K, Paul O
  LED-Based Optogenetic Tools - Are Smallest LEDs Always Requested and Reasonable?
  2020 ICAN Workshop 2./3.3.2020, College of Health and Life Sciences at Hamad Bin Khalifa University, Doha, Qatar
  
   
  PDF-Datei herunterladen
• Ruther P, Ayub S, Klein E, Sharma K, Paul O
  MEMS tools based on integrated light sources for optogenetics
  2020 beim Physikalisches Kolloquium, Institut für Physik, Universität Chemnitz
  
   
  PDF-Datei herunterladen
• Ruther P, Ayub S, Klein E, Sharma K, Paul O
  Optical MEMS tools based on light-emitting diodes for optogenetics
  2020 Max Planck Institute for Biological Cybernetics, Max-Planck-Ring 8, D-72076 Tübingen

2018

 nach oben zur Jahresübersicht

• Ruther P
  LED-based MEMS Tools for Optogenetic Applications Aside from Cerebral Tissue
  2018 ICAN – International Conference for Advanced Neurotechnology, University of Michigan, Ann Arbor, USA, 7./8. May 2018
• Klein E, Gossler C, Paul O, Ruther P
  Thin-film LED Arrays on Flexible Substrates With Improved Thermomechanical Behaviour
  2018 ICAN – International Conference for Advanced Neurotechnology, University of Michigan, Ann Arbor, USA, 7./8. May 2018
• Ruther P
  Interfacing the brain with micromachined implants
  2018 TU Einhoven
• Ruther P
  High-density neural probe arrays using CMOS and MEMS technologies
  2018 Neuroelectronic Interfaces, Beyond Feasibility - Bridging the Gap in Neuroelectronic Interfaces,Gordon Research Conference, March 25-30, 2018, Galveston,TX, USA
• Otte E, Ayub S, Paul O, Ruther P
  Implantable Optrode Enabling Electrophysiology and Optogenetic Stimulation
  2018 ICAN – International Conference for Advanced Neurotechnology, University of Michigan, Ann Arbor, USA, 7./8. May 2018
• Barz F, Ruther P, Asplund M
  Influence of the Oxygen Flow Rate on the pH Response of Reactively Sputter-deposited Iridium Oxide Films
  2018 EMBC 2018 Conf., Hawaii, USA

2017

 nach oben zur Jahresübersicht

• Ruther P, Klein E, Ayub S, Gossler C, Schwärzle M
  Implantable MEMS-based tools for optogenetics
  2017 12th International Conference on Nitride Semiconductors, July 24-28, 2017 - Strasbourg, France
• Ruther P, Sayed Herbawi A, Klein E, Schwärzle M, Barz F, Pothof F, Paul O
  How to interface the brain with MEMS-based implants?
  2017 43rd International Conference on Micro and Nano Engineering, 18.-22. September 2017

2016

 nach oben zur Jahresübersicht

• Ruther P
  Let there be light - How MEMS directly enlightens the brain?
  2016 KIT Campus North, Karlsruhe
• Schwärzle M, Ayub S, Barz F, Paul O, Ruther P
  LED and laser diode based MEMS tools for optogenetics
  2016 International Workshop for Advanced Neurotechnology (ICAN), University of Michigan, Ann Arbor, USA, 13.-14. June 2016
• Ruther P
  MEMS-based technologies for optogenetic applications, Symposium on Restoration of sensory and motor function
  2016 Universitätsmedizin Göttingen, 26./27. May 2016
• Ruther P
  How to illuminate brain tissue?
  2016 IGSN Workshop, University of Bochum
• Ruther P
  Innovative tools for electrophysiology and optogenetics based on MEMS technologies
  2016 Medizinische Hochschule Hannover, 23.3.2016
• Ruther P
  Trends in Silicon-based Neural Probe Arrays Used in Electrophysiology and Optogenetics
  2016 GDR 2904 Multielectrode Systems for Neuroscience: 6th Annual Meeting, 5-8 Jan 2016 Grenoble-Autrans (France)
• Ruther P
  CMOS-based probe arrays for high-density neural recordings
  2016 Bernstein Sparks Workshop, Tutzing, 28./29. June 2016
• Ruther P, Pothof F, Barz F, Bonini L, Orban GA, Stieglitz T, Paul O
  MEMS Technologies for High-Channel Count SEEG Probes
  2016 Insights from the inside Workshop, Intracranial studies of the human brain, 30.11.16-01.12.16, Tel-Aviv, Israel
• Paul O, Ruther P
  MEMS Tools for Bidirectional Brain-Machine Interfaces
  2016 International Workshop for Advanced Neurotechnology (ICAN), University of Michigan, Ann Arbor, USA, 13.-14. June 2016
• Gordillo C, Kuhner A, Schubert T, Burgard W, Bast H, Becker B, Bennewitz M, Galchev T, Keller M, Manoli Y, Maurer C, Paul O, Ruther P, Stachniss C
  Robotics meets neuroscience: Electode selection and motion analysis
  2016 International Workshop for Advanced Neurotechnology (ICAN), University of Michigan, Ann Arbor, USA, 13.-14. June 2016

2015

 nach oben zur Jahresübersicht

• Ruther P
  Optoelectronic devices Optrodes with integrated light sources based on MEMS technologies
  2015 Optogenetics Workshop, University of Bochum
• Ruther P
  High-density neural recording based on advanced silicon probe technologies
  2015 Magnetrodes Workshop, Lisbon, Portugal, 23.-25.11.2015
• Ruther P, Schwärzle M, Gossler C, Ayub S, Schwarz U, Paul O
  Highly compact MEMS-based optrodes with integrated light sources
  2015 SPIE Photonics West Conf. 2015, San Francisco, USA, 7.-12.2.2015
• Ruther P, Schwarz U, Schwärzle M, Elmlinger P, Gossler C, Paul O
  MEMS-based Neural Implants for Optogenetic Applications New System Developments at IMTEK
  2015 NAMIS Workshop 2014, Halong Bay, Vietnam, 2.-4.6.2014
• Schwarz U, Ruther P, Paul O
  Micro-engineered probes for optogenetics
  2015 DFG-NSF Workshop - New Perspectives on Neuroengineering and Neurotechnologies, Arlington, November 13/14, 2014

2014

 nach oben zur Jahresübersicht

• Ruther P
  Advanced Silicon Probes for Large-Scale Neural Recording
  2014 DFG-NSF Workshop - New Perspectives on Neuroengineering and Neurotechnologies, Arlington, USA, November 13/14, 2014

Konferenzbeiträge

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2020

 nach oben zur Jahresübersicht

• Weber T, Zgierski-Johnston C, Klein E, Ayub S, Paul O, Kohl P, Ruther P
  Concentric MEMS-based Opto-electro-mechanical Pacer for Multimodal Cardiac Tissue Excitation
  2020 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, Canada
  » Kurzfassung anzeigen« Kurzfassung verbergen
  Kurzfassung

  This paper reports on the fabrication, assembly, characterization and validation of a novel opto-electrical cardiac stimulator designed to augment a mechanical pacing device. The integration of miniaturized electrodes and blue light-emitting diode (LED) chips on the pacer tip with a diameter of 1 mm enables the application of multimodal stimuli in one location on the surface of isolated murine hearts. The opto-electrical stimulator is based on two separate polyimide (PI) substrates each with a thickness of 10 μm combined into a functional unit based on dedicated assembly and encapsulation processes using silicone rubber. The experimental validation in isolated, whole hearts compares electrical, optical and mechanical stimuli exerted at frequencies of up to 8 Hz on Langen-dorff-perfused hearts expressing channelrhodopsin-2. The integrated iridium oxide electrodes implemented above the LED chips enable simultaneous electrical recordings of local cardiac electrical activity.
• Hafner J, Moazenzadeh A, Heinen F, Rodriguez M, Wallrabe U, Paul O
  Long-range telemetric smart orthodontic bracket with CMOS-integrated 3D wirebonder-fabricated microcoils
  2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, Canada , Seiten: 1266 - 1269
  » Kurzfassung anzeigen« Kurzfassung verbergen
  Kurzfassung

  This paper reports a novel telemetric smart bracket (TSB) for in vivo force/moment measurements during clinical orthodontic applications. The prototype implements a novel microcoil design resulting in a significant increase of the transmission distance compared to the previous state-of-the-art TSB. Using an automatic wirebonder, the microcoil is wound around an SU-8 post attached to the CMOS sensor wafer. For the first time, thus, 3D wirebonder-fabricated microcoils were integrated on a CMOS substrate, without compromising CMOS functionality. The augmented CMOS system serves here as a force/moment measurement device with six-degree-of-freedom (fx, fy, fz, mx, my, mz) functionality. The achieved transmission distance, i.e. coil-to-coil distance, was thereby increased by 80% compared to the best previous design to 5 mm, without the need for the system to exceed the severe size constraints of 2×2.8×1 mm 3 defined by the bracket dimensions. The increased transmission distance allows uncritical contactless system powering and readout.

2019

 nach oben zur Jahresübersicht

• Huber S, Lázár Z, Berger M, Paul O
  A CMOS Hall-based magnetic multisensor system free from parasitic effects of temperature and package stress
  2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII, Berlin/Germany , Seiten: 134 - 137
• Berger M, Becker F, Paul O
  Guidelines for multisensor system calibration with and without regularization
  2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII, Berlin/Germany , Seiten: 2103 - 2106
• Morikawa Y, Ayub S, Paul O, Kawano T, Ruther P
  Highly stretchable kirigami structure with integrated LED chips and electrodes for optogenetic experiments on perfused hearts
  2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII, Berlin/Germany , Seiten: 2484 - 2487
• Klein E, Kaku Y, Paul O, Ruther P
  Flexible µLED-based optogenetic tool with integrated µ-lens array and conical concentrators providing light extraction improvements above 80%
  2019 IEEE MEMS 2019, Seoul, Korea , Seiten: 632 - 635
• Sharma K, Dholipet Nagendra Kumar S, Paul O, Ruther P
  Microfluidic neural probes with buried channels fabricated using continuous flow XeF³ etching of silicon
  2019 IEEE MEMS 2019, Seoul, Korea , Seiten: 569 - 572
• Shui B, De Dorigo D, Sayed Herbawi A, Ruther P, Paul O, Manoli Y, Kuhl M
  A Slim Needle Neural Probe with 160 Active Recording Sites and Selectable ADCs
  2019 Biomedical Circuits and Systems Conf. (BioCAS) 2019, Nara Japan, 17.-19. October 2019
• Klein E, Kaku Y, Paul O, Ruther P
  Flexibles, µLED-basiertes Implantat mit integrierten µ-Linsen und konischen Konzentratoren mit optimierter Lichtausbeute
  2019 MikroSystemTechnik Kongress 2019, 28.-30. Oktober 2019, Berlin, Germany , Seiten: 205 - 208

2018

 nach oben zur Jahresübersicht

• Hoch K, Pothof F, Becker F, Paul O, Ruther P
  A Magnetic, Micro-spring-suspended System for the Safe Electrical Interconnection of Neural Implants
  2018 IEEE MEMS Conf. 2018, Belfast, Ireland , Seiten: 369 - 372
• Diaz-Maue L, Schwaerzle M, Ruther P, Luther S, Richter C
  Follow the Light - From Low-Energy Defibrillation to Multi-Site Photostimulation
  2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA , Seiten: 4832 - 4835
  » Kurzfassung anzeigen« Kurzfassung verbergen
  Kurzfassung

  One major cause of death in the industrialized world is sudden cardiac death, which so far can be reliably treated only by applying strong electrical shocks. Developing improved methods, aiming at lowering shock intensity and associated side effects potentially has significant clinical implications. Thus, optogenetic stimulation using structured illumination has been introduced as a promising experimental tool to investigate mechanisms underlying multi-site pacing and to optimize potential low-energy approaches. Furthermore, an objective of this work is to strengthen the application of optogenetic tools for cardiac arrhythmia research, which in turn is expected to improve applicable technologies towards tissue-protective defibrillation.
• Diaz-Maue L, Schwärzle M, Ruther P, Luther S, Richter C
  Follow the light - from low-energy defibrillation to multi-site photostimulation
  2018 EMBC 2018 Conference, Hawaii, USA
• Ayub S, Ruther P, Paul O, Kohl P, Zgierski-Johnston CM
  Invasive Optical Pacing in Perfused, Optogenetically Modified Mouse Heart Using Stiff Multi-LED Optical Probes
  2018 40th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Honolulu, HI, USA , Seiten: 4836 - 4839
  » Kurzfassung anzeigen« Kurzfassung verbergen
  Kurzfassung

  We present the first invasive use of a stiff, multiLED optical probe for intramural optical stimulation of cardiac tissue. We demonstrate that optical pacing is possible with high spatial and temporal resolution in transgenic mice expressing channelrhodopsin-2. The technical implementation of this study builds on optical probes recently developed and tested ex vivo in cerebral tissue of mice. The probes comprise LEDs integrated on flexible substrates stiffened by silicon-based MEMS structures enabling the successful penetration into the cardiac tissue. The probe technology is extended to allow dual-sided illumination for directional tissue stimulation. Implantation trials affirm the ability to optically pace the isolated perfused heart at stimulation frequencies between 4Hz and 12Hz with experimentally determined emittance levels of 10mW mm-2Rapid activation of two distant LEDs could reliably be used to induce short runs of ventricular fibrillation, while simultaneous activation of all LEDs allowed termination of re-entrant rhythm disturbances (optical defibrillation). Thus, spatially-resolved intramural pacing and rhythm control of the isolated heart is possible using stiff, multi-LED optical probes.
• Otte E, Ayub S, Paul O, Ruther P
  LED-based Intracerebral Optrode for Simultaneous Optical Stimulation and Electrophysiological Recording
  2018 IEEE MEMS Conf. 2018, Belfast, Ireland , Seiten: 384 - 387

2017

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• Ayub S, Goßler C, Engesser F, Paul O, Ruther P
  Compact intracerebral probe with yellow phosphor-based light conversion for optogenetic control
  2017 IEEE Transducers 2017, Kaohsiung / Taiwan
• Sayed Herbawi A, Kießner L, Paul O, Ruther P
  High-density CMOS neural probe implementing a hierarchical addressing scheme for 1600 recording sites and 32 output channels
  2017 IEEE Transducers 2017, Kaohsiung / Taiwan
• Pothof F, Chauvière L, Holzhammer T, Aarts A, Paul O, Singer W, Ruther P
  Comparison of the in-vivo neural recording quality of floating and skull-fixed silicon probes
  2017 8th International IEEE EMBS Conference on Neural Engineering , Seiten: 158 - 161
• Pothof F, Sharma K, Paul O, Ruther P
  High-channel-count impedance spectroscopy logger
  2017 8th International IEEE EMBS Conference on Neural Engineering , Seiten: 211 - 214
• Schwärzle M, Ringwald P, Paul O, Ruther P
  First dual-color optrode with bare laser diode chips directly butt-coupled to hybrid-polymer waveguides
  2017 IEEE MEMS 2017, Las Vegas, NV, USA
• Klein E, Goßler C, Paul O, Schwarz U T, Ruther P
  High-yield indium-based wafer bonding for large-area multi-pixel optoelectronic probes for neuroscience
  2017 IEEE MEMS 2017, Las Vegas, NV, USA
• Gullo M, Takeuchi S, Paul O
  Muscle-actuated biomimetic hydrogel-based 3D microskeleton
  2017 IEEE MEMS 2017, Las Vegas, NV, USA , Seiten: 101 - 104
• Hafner J, Paul O, Kuhl M, Hehn T, Rossbach D
  Fabrication of Planar Copper Microcoils for Telemetric Orthodontic Applications
  2017 Eurosensors 2017, 03.-06.09.2017, Paris/France,
• Klein E, Gossler C, Paul O, Ruther P
  High-density µLED-based Optical Cochlear Implant with Improved Thermo-mechanical Behavior
  2017 OPTOGEN 2016, 3rd Int. Workshop on Technologies for Optogenetics, Freiburg/Germany, 05.-06.12.2016 Book of Abstracts, Seiten: 27 - 27
• Klein E, Ayub S, Gossler C, Paul O, Ruther P
  High-density μLED probes on flexible and stiff substrates
  2017 SfN 2017, 11.-15.11.2017, Washington DC/USA
• Ayub S, Otte E, Paul O, Ruther P
  Intracerebral optrodes with integrated LED chips and recording electrodes for optogenetic experiments
  2017 OPTOGEN 2016, 3rd Int. Workshop on Technologies for Optogenetics, Freiburg/Germany, 05.-06.12.2016 Book of Abstracts, Seiten: 16 - 16
• Schwärzle M, Ayub S, Paul O, Ruther P
  Optical tools with integrated light sources for optogenetics - An analysis of different system approaches
  2017 Society for Neuroscience - Neuroscience 2017, Washington, DC / USA
• Schwärzle M, Ringwald P, Paul O, Ruther P
  Zweifarbige Optrode basierend auf ungehäusten Laserdioden und hybridpolymeren Wellenreitern für optogenetische Anwendungen
  2017 MikroSystemTechnik Kongress 2017, München, 23.-25.10.2017 , Seiten: 816 - 819

2016

 nach oben zur Jahresübersicht

• Schröder T, Constantinescu V.S., Schwärzle M, Ayub S, Ruther P, Battaglia F.P.
  Modulation of downstream targets by spatio-temporal pattern stimulation of primary somatosensory cortex
  2016 Society for Neuroscience, San Diego/USA
• Sayed Herbawi A, Velarde F, Paul O, Galchev T
  Self-powered CMOS active rectifier suitable for low-voltage mechanical energy harvesters
  2016 IEEE Sensors 2016, Orlando, USA
• Gordillo C, Frank B, Ulbert I, Paul O, Ruther P, Burgard W
  Automatic Channel Selection in Neural Microprobes: A Combinatorial Multi-Armed Bandit Approach
  2016 IROS 2016, Daejeon, Korea
• Pothof F, Sharma K, Paul O, Ruther P
  Cost-effective, high-channel-count system for impedance spectroscopy
  2016 BMT 2016, Basel, Schweiz , Seite: 241
• Stieglitz T, Fiedler E, Vasjari D, Benlter C, Liljemalm R, Pothof F, Sayed Herbawi A, Barz F, Kuhl M, Paul O, Ruther P
  Developments for the next generation of brain probes
  2016 BMT 2016, Basel, Schweiz , Seite: 237
• Ayub S, Barz F, Paul O, Ruther P
  Heterogeneous 3D optrode with variable spatial resolution for optogenetic stimulation and electrophysiological recording
  2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society
• Heizmann S, Holzhammer T, Kilias A, Egert U, Ruther P, Asplund M
  Dye delivery from PEDOT electrodes in vivo - a new way to reconstruct recording sites
  2016 10th International Meeting on Substrate Integrated Microelectrode Arrays, Reutlingen, Germany
• Boehler C, Kleber C, Heizmann S, Ruther P, Hofmann U, Egert U, Ruehe J, Stieglitz T, Asplund M
  Nanostructured and biofunctionalized coatings for microscale electrodes: bringing cutting edge materials science to microsystems engineered implants
  2016 10th World Biomaterials Congress, Montréal, Canada
• Schwärzle M, Nehlich J, Schwarz U T, Paul O, Ruther P
  Hybrid polymer waveguide characterization for microoptical tools with integrated laser diode chips for optogenetic applications at 430 nm and 650 nm
  2016 SPIE Photonics West, San Fransciso/USA
• Ayub S, Goßler C, Schwärzle M, Klein E, Paul O, Schwarz U T, Ruther P
  High-density probe with integrated thin-film micro light emitting diodes
  2016 IEEE MEMS Conf. 2016, Shanghai, China
• Schwärzle M, Nehlich J, Ayub S, Paul O, Ruther P
  LED-based optical chchlear implant on highly flexible triple layer polyimide substrates
  2016 IEEE MEMS Conf. 2016, Shanghai, China
• Gullo M, Takeuchi S, Paul O
  Muscle-actuated bio-hybrid MEMS by cell culture and differentiation on metamaterial micro-scaffolds
  2016 IEEE MEMS Conf. 2016, Shanghai, China
• Barz F, Lausecker R, Wallrabe U, Ruther P, Paul O
  Wafer-level shellac-based interconnection process for ultrathin silicon chips of arbitrary shape
  2016 IEEE MEMS Conf. 2016, Shanghai, China
• Fiáth R, Ayub S, Paul O, Ruther P, Ulbert I
  In vivo validation of compact LED probes with apertures
  2016 OPTOGEN 2016, 3rd Int. Workshop on Technologies for Optogenetics, Freiburg/Germany, 05.-06.12.2016 Book of Abstracts, Seiten: 34 - 34
• Ayub S, Engesser F, Paul O, Ruther P
  Intracerebral optical probes with light confinement for optogenetic experiments
  2016 OPTOGEN 2016, 3rd Int. Workshop on Technologies for Optogenetics, Freiburg/Germany, 05.-06.12.2016 Book of Abstracts, Seiten: 33 - 33
• Gossler C, Ayub S, Klein E, Schwärzle M, Paul O, Ruther P
  Optical probes with integrated thin-film µLEDs on flexible and rigid substrates
  2016 OPTOGEN 2016, 3rd Int. Workshop on Technologies for Optogenetics, Freiburg/Germany, 05.-06.12.2016 Book of Abstracts, Seiten: 12 - 12
• Constantinescu V, Schröder T, Schwaerzle M, Ayub S, Ruther P, Battaglia F
  Optogenetic stimulation of spatial-temporal activity patterns in cortex by epidural LED grids and downstream effects on higher-order cortical areas
  2016 OPTOGEN 2016, 3rd Int. Workshop on Technologies for Optogenetics, Freiburg/Germany, 05.-06.12.2016 Book of Abstracts, Seiten: 36 - 36
• Raz R, Schwärzle M, Paul O, Ruther P
  Polymer Based Thin-film Packaging of an Optical Cochlear Implant
  2016 OPTOGEN 2016, 3rd Int. Workshop on Technologies for Optogenetics, Freiburg/Germany, 05.-06.12.2016 Book of Abstracts, Seiten: 24 - 24

2015

 nach oben zur Jahresübersicht

• Becker F, Kuhl M, Manoli Y, Paul O
  Novel method to operate Piezo-FET-based stress sensor offers tenfold increase in sensitivity
  2015 IEEE Sensors Conference 2015, Busan, South Korea
• Schwärzle M, Elmlinger P, Paul O, Ruther P
  Miniaturisiertes 3×3 LED-Array mit integrierten Glasfasern und hochflexiblem Flachbandkabel für Anwendungen in der Optogenetik
  2015 MST-Kongress 2015, Karlsruhe, Germany , Seiten: 294 - 297
• Becker F, Kuhl M, Manoli Y, Paul O
  Neuartiger Smart Tooth mit zehnfach höherer Kraftauflösung
  2015 MST-Kongress 2015, Karlsruhe, Germany
• Pothof F, Bonini L, Lanzilotto M, Livi A, Fogassi L, Orban G.A., Paul O, Ruther P
  In-vivo validation of a cylindrical 64-channel depth probe with a diameter of 800 µm
  2015 Society for Neuroscience 2015, Chicago, Illinois, United States
• Schwärzle M, Pothof F, Elmlinger P, Paul O, Ruther P
  LED-based neural probes for optogenetics
  2015 Annual Meeting of the Society of Neuroscience, Chicago, USA
• Pothof F, Galchev T, Patel M, Sayed Herbawi A, Paul O, Ruther P
  Heterogeneous integration of analog CMOS chips on flexible substrates for high-resolution deep brain epilepsy diagnosis
  2015 Eurosensors 2015, Freiburg, Germany
• Pothof F, Galchev T, Patel M, Sayed Herbawi A, Paul O, Ruther P
  128-channel deep brain recording probe with heterogenously integrated analog CMOS readout for focal epilepsy localization
  2015 Transducers 2015, Anchorage, Alaska, USA
• Huber S, Raman J, van der Wiel A, Schott C, Rombouts P, Paul O
  A combined hall and stress sensor for highly accurate magnetic field sensing free from the piezo-hall effect
  2015 Transducers 2015, Anchorage, Alaska, USA
• Sayed Herbawi A, Larramendy F, Galchev T, Holzhammer T, Mildenberger B, Paul O, Ruther P
  CMOS-based neural probe with enhanced electronic depth control
  2015 Transducers 2015, Anchorage, Alaska, USA
• Goda K, Yoshioka T, Ao K, Abe R, Paul O
  Charge transport in SiO2/Si3N4 and SiO2/Si-rich SiN electrets for high-temperature electrostatic energy micro-harvesters
  2015 Transducers 2015, Anchorage, Alaska, USA
• Moser D, Müller D, Paul O
  Compact multifunctional test structure to measure the in-plane thermoelectric figure of merit ZT of thin films
  2015 Transducers 2015, Anchorage, Alaska, USA
• Schwärzle M, Pothof F, Paul O, Ruther P
  High-resolution neural depth probe with integrated 460 nm light emitting diode for optogenetic applications
  2015 Transducers 2015, Anchorage, Alaska, USA
• Sander C, Leube C, Paul O
  Novel compact two-dimensional CMOS vertical hall sensor
  2015 Transducers 2015, Anchorage, Alaska, USA
• Becker F, Kuhl M, Manoli Y, Paul O
  Novel instrumented tooth with tenfold increase in force resolution
  2015 Transducers 2015, Anchorage, Alaska, USA
• Larramendy F, Yoshida S, Fekete Z, Serien D, Takeuchi S, Paul O
  Stackable octahedron-based photoresist scaffold by direct laser writing for controlled three-dimensional cell networks
  2015 Transducers 2015, Anchorage, Alaska, USA
• Heizmann S, Kilias A, Okujeni S, Boehler C, Ruther P, Egert U, Asplund M
  Accurate neuronal tracing of microelectrodes based on PEDOT-dye coatings
  2015 7th Annual International IEEE EMBS Conference on Neural Engineering, Montpellier, France
• Hoch K, Pothof F, Paul O, Ruther P
  Development and validation of a characterization setup for depth neural probes
  2015 IENSSC 2015, Istanbul, Turkey
• Becker F, Sander C, Schmidt F, Lapatki B, Paul O
  An instrumented tooth
  2015 IEEE MEMS, Estoril, Portugal
• Barz F, Ruther P, Takeuchi S, Paul O
  Flexible silicon-polymer neural probe rigidified by dissolvable insertion vehicle for high-resolution neural recording with improved duration
  2015 IEEE MEMS 2015, Estoril, Portugal , Seiten: 636 - 639
• Larramendy F, Serien D, Yoshida S, Jalabert L, Takeuchi S, Paul O
  High-topography surface functionalization based on parylene-C peel-off for patterned cell growth
  2015 IEEE MEMS Conf. 2015, Estoril, Portugal
• Sander C, Leube C, Aftab T, Ruther P, Paul O
  Isotropic 3D silicon hall sensor
  2015 IEEE MEMS, Estoril, Portugal
• Schwärzle M, Elmlinger P, Paul O, Ruther P
  Miniaturized 3×3 optical fiber array for optogenetics with integrated 460 nm light sources and flexible electrical interconnection
  2015 IEEE MEMS Conf. 2015, Estoril, Portugal
• Ayub S, Schwärzle M, Paul O, Ruther P
  An intracerebral probe with integrated 10x1 µLED array for optogenetic experiments at 460 nm
  2015 XXIX Eurosensors 2015, Freiburg, Germany
• Sayed Herbawi A, Mildenberger B, Larramendy F, Holzhammer T, Galchev T, Paul O, Ruther P
  CMOS-based high-density neural probes with improved scheme for addressing recording and stimulation channels
  2015 XXIX Eurosensors 2015, Freiburg, Germany
• Genter S, Langhof T, Paul O
  Electret-Based Out-Of-Plane Micro Energy Harvester with Parylene-C Serving as the Electret and Spring Material
  2015 XXIX Eurosensors 2015, Freiburg, Germany
• Sander C, Leube C, Aftab T, Ruther P, Paul O
  Geometry study of an isotropic 3D Silicon Hall Sensor
  2015 XXIX Eurosensors 2015, Freiburg, Germany
• Schwärzle M, Pothof F, Paul O, Ruther P
  High-resolution optrode with integrated light source for deeper brain regions
  2015 XXIX Eurosensors 2015, Freiburg, Germany
• Schwärzle M et al.
  LED-based neural probes for optogenetics
  2015 Society for Neuroscience 2015, Chicago, Illinois, United States
• Barz F, Ruther P, Takeuchi S, Paul O
  Mechanically adaptive silicon-based neural probes for chronic high-resolution neural recording
  2015 XXIX Eurosensors 2015, Freiburg, Germany
• Bonini L, Livi A, Lanzilotto M, Maranesi A, Ruther P, Barz F, Fogassi L, Rizzolatti G
  Visuo-motor processing of objects in pre-supplementary motor area F6 neurons of the macaque
  2015 Society for Neuroscience 2015, Chicago, Illinois, United States

2014

 nach oben zur Jahresübersicht

• Genter S, Paul O
  Influence of various conducting and inorganic dielectric drift barriers on the charge decay in parylene-C electret layers
  2014 PowerMEMS 2014, Awaji Island, Hyogo, Japan
• Nomura M, Maire J, Kage Y, Moser D, Paul O
  Reduced thermal conductivity in 1D and 2D phononic crystal nanstructures
  2014 Eurotherm 103: NMHT IV, Lyon, France
• Vysotska O, Frank B, Ulbert I, Paul O, Ruther P, Stachniss C, Burgard W
  Automatic channel selection and neural signal estimation across channels of neural probes
  2014 2014 IEEE/RSJ International Conference on Intelligent Robots and Systems, Chicago, USA , Seiten: 1453 - 1459
• Dang W, Barz F, Paul O, Ruther P
  Technology for the highly compact interconnection of neural probes with flexible ribbon cables
  2014 MicroMechanics Europe Workshop 2014, Istanbul
• Pothof F, Anees S, Leupold J, Bonini L, Paul O, Orban G.A, Ruther P
  Fabrication and characterization of a high-resolution neural probe for stereoelectroencephalography and single neuron recording
  2014 IEEE EMBC 2014, Chicago, USA , Seiten: 5244 - 5247
• Schwärzle M, Elmlinger P, Paul O, Ruther P
  Miniaturized Tool for Optogenetics Based on an LED and an Optical Fiber Interfaced by a Silicon Housing
  2014 36th Ann. Int. Conf. of the IEEE Eng. in Med. and Biol. Soc. (EMBC) 2014, Chicago , Seiten: 5252 - 5255
• Barz F, Paul O, Ruther P
  Modular assembly concept for 3D neural probe prototypes offering high freedeom of design and alignement precision
  2014 IEEE EMBC 2014, Chicago, USA , Seiten: 3977 - 3980
• Goßler C, Schwärzle M, Ruther P, Paul O, Schwarz U.T.
  Optrodes with arrays of integrated micro-LEDs
  2014 International Workshop on Nitride Semiconductors, Wroclaw, Poland
• Heizmann S, Kilias A, Ringwald P, Okujeni S, Böhler C, Ruther P, Egert U, Asplund M
  Precise detection of recording positions by accurate neural tracing from PEDOT-based microelectrodes
  2014 Forum of Neuroscience 2014, Milano, Italy
• Heizmann S, Kilias A, Ringwald P, Okujeni S, Boehler C, Ruther P, Egert U, Asplund M
  Precise labeling of microelectrode positions by accurate neuronal tracing based on pedot-dye coatings
  2014 9th Forum of Neuroscience, Milano, Italy
• Martin T, Gengenbach U, Ruther P, Paul O, Bretthauer G
  Realization of Actuator Systems for an Implantable Artificial Accommodation System
  2014 ACTUATOR 2014, Bremen, Germany
• Paul O, Ruther P
  MEMS and more for the brain - THE cluster of excellence BrainLinks-BrainTools at the University of Freiburg
  2014 Actuator and Microsystems Workshop (Hilton Head) 2014 Proc. IEEE Solid-State Sensor, Seiten: 1 - 4
• Sander C, Vecchi M C, Cornils M, Paul O
  Ultra-low offset vertical Hall sensor in CMOS technology
  2014 Procedia Engineering

2013

 nach oben zur Jahresübersicht

• Genter S, Paul O
  Influence of a SiN drift-barrier on the charge decay in parylene-C electret layers
  2013 Power MEMS 2013, London, Great Britain
• Schwärzle M, Paul O, Ruther P
  Characterization of silicon-based optrodes with integrated laser diode chips and SU-8 waveguides
  2013 Society for Neuroscience, San Diego/USA
• Sayed Herbawi A, Paul O, Galchev T
  An ultra-low-power active AC-DC CMOS converter for sub-1V integrated energy harvesting applications
  2013 IEEE Sensors Conference 2013, Baltimore, USA
• Sander C, Raz R, Ruther P, Paul O, Kaufmann T, Cornils M, Vecchi M.C.
  Fully symmetric vertical hall devices in CMOS technology
  2013 IEEE Sensors Conference 2013, Baltimore, USA
• Barz F, Paul O, Ruther P
  3D assembly of intracortical neural probe arrays
  2013 MST-Kongress 2013, Aachen, Deutschland
• Sander C, Cornils M, Vecchi M.C., Paul O
  Sensitivitätsoptimierung von vertikalen Hallsensoren mit drei Kontakten
  2013 MST-Kongress 2013, Aachen, Deutschland
• Becker F, Sander C, Schmidt F, Lapatki B, Paul O
  Smart Tooth
  2013 MST-Kongress 2013, Aachen, Germany
• Simon P, Paul O
  Novel concept and technology for a self resonant magnetic field sensor
  2013 Transducers 2013, Barcelona, Spain
• Barz F, Holzhammer T, Paul O, Ruther P
  Novel technology for the in-plane to out-of-plane transfer of multiple interconnection lines in 3D neural probes
  2013 Transducers 2013, Barcelona, Spain
• Wang Z, Ruhhammer J, Adhikari S, Rostek R, Moser D, Paul O, Kojda D, Mitdank R, Fischer S F, Toellner W, Nielsch K, Kroener M, Woias P
  Thermoelectric properties investigation of single nanowires by utilizing a thermoelectric nanowire characterization platform
  2013 NEMS 2013, Suzhou / China
• Galchev T, Raz R, Paul O
  An electrostatic springless enertial harvester for converting multi-dimensional low-frequency motion
  2013 MEMS 2013 Conference, Taipeh / Taiwan
• Schwärzle M, Seidl K, Schwarz U T, Paul O, Ruther P
  Ultracompact optrode with integrated laser diode chips and SU-8 waveguides for optogenetic applications
  2013 MEMS 2013 Conference, Taipeh / Taiwan
• Lee Y-T, Moser D, Holzhammer T, Fang W, Paul O, Ruther P
  Ultrathin, dual-sided silicon neural microprobes realized using BCB bonding and aluminum sacrificial etching
  2013 MEMS 2013 Conference, Taipeh / Taiwan

2012

 nach oben zur Jahresübersicht

• P. Pursula, J. Saarilahti, O. Paul, V. Vikari
  Analytical electromechanical modelling of a cmuts with multilayered, non-uniform thickness diaphragm
  2012 MME 2012, Ilmenau, German
• Handwerker J, Gieschke P, Baumann M, Paul O
  CMOS Integrated Silicon/Glass-Bonded 3D Force/Torque Sensor
  2012 IEEE MEMS 2012 Conference, Paris, France
• Baumann M, Peter A, Moser D, Ruther P, Paul O
  CMOS-Based Force Sensor withOverload Protection and Improved Assembly Tolerance
  2012 IEEE MEMS 2012, Paris, France
• Paul O
  CMOS-integrated Four-contact Sensors for Magnetic and Mechanical Signals: Novel Devices, Systems, and Applications
  2012 IEEE Sensors 2012, Taipeh / Taiwan , Seiten: 174 - 177
• Vittoriosi A, Brandner J J, Ruther P, Paul O, Dittmeyer R
  Design and Characterization of Integrated Microsensors for Heat Transfer Studies in Microchannels
  2012 3rd European Conference on Microfluidics (µFlu'12), Heidelberg, Germany , Band: 228, Seiten: 1 - 10
• Moser D, Ilkaya D, Kopp D, Paul O
  Determination of the thermoelectric figure of merit of doped polysilicon thin films by micromachined test structures
  2012 IEEE Sensors 2012, Taipeh / Taiwan
• Moser D, Seidl K, Paul O, Ruther P
  Fabrication of microfluidic neural probes with in-channel electrodes
  2012 IEEE Sensors 2012, Taipeh / Taiwan
• Le Huy V, Kamiya S, Gaspar J, Paul O
  Identification of Fatigue Crack Extension Process in Zero-Tension Cyclic Stress Test of Polysilicon Films
  2012 IEEE MEMS 2012 Conference, Paris, France
• Lemke B, Paul O
  MEMS Systems for Microelectronic Packaging Testing
  2012 NMJ2012, Beijing, China
• Huber S, Paul O
  Package stress monitor to compensate for the piezo-Hall effect in CMOS hall sensors
  2012 IEEE Sensors 2012, Taipeh / Taiwan
• Mueller J, Paul O, Burgard W
  Probabilistic Velocity Estimation for Autonomous Miniature Airships using Thermal Air Flow Sensors
  2012 2012 IEEE International Conference on Robotics and Automation, Saint Paul, Minnesota, USA , Seiten: 39 - 44
• Stephan J, Retan K, Ruther P, Paul O
  The inverse magnetic shape memory effect in membranes for pressure sensor applications
  2012 IEEE Sensors 2012, Taipeh / Taiwan

2011

 nach oben zur Jahresübersicht

• Kaufmann T, Kopp D, Kunzelmann M, Ruther P, Paul O
  Piezo-Hall Effect of CMOS-Based Vertical Hall Devices
  2011 IEEE Sensors 2011 Conference, Limerick, Ireland , Seiten: 440 - 443
• M. Kuhl, P. Gieschke, O. Paul, Y. Manoli
  A Differential Difference Amplifier With Automatic Gain Selection as Readout Interface for CMOS Stress Sensors in Orthodontic Brackets
  2011 Transducers'11, Beijing, China , Seiten: 819 - 822
• M. Kuhl, P. Gieschke, D. Rossbach, S.A. Hilzensauer, P. Ruther, O. Paul, Y. Manoli
  A Telemetric Stress-Mapping CMOS Chip with 24 FET-Based Stress Sensors for Smart Orthodontic Brackets
  2011 2011 IEEE International Solid-State Circuits Conference , Seiten: 108 - 110
• Martin Th, Gengenbach U, Guth H, Ruther P, Paul O, Bretthauer G
  Actuation of an Intraocular Implant Based on a Compliant Silicon Mechanism and a Piezoelectric Bender with Energy Efficient Driving Electronics
  2011 45. DGBMT Jahrestagung, Freiburg, Germany Proceeding BMT 2011
• S. Herwik, T. Holzhammer, O. Paul, P. Ruther
  Assembly Method for 3D Neural Probe Arrays Utilizing SU-8-based Thermal Actuators
  2011 DGBMT Jahrestagung, Freiburg, Germany , Band: 56
• Seidl K, Herwik S, Torfs T, Neves H P, Paul O, Ruther P
  CMOS-Based High-Density Silicon Microprobe Arrays for Electronic Depth Control in Intracortical Neural Recording
  2011 45. DGBMT Jahrestagung, Freiburg, Germany Proceedings BMT 2011
• P. Ruther, T. Holzhammer, S. Herwik, P. D. Rich, J. W. Dalley, O. Paul, T. Holtzman
  Compact Wireless Neural Recording System for Small Animals Using Silicon-based Probe Arrays
  2011 33rd Annual International Conference of the IEEE EMBS , Seiten: 2284 - 2287
• Holzhammer T, Holztman T, Herwik S, Rich P D, Dalley J W, Paul O, Ruther P
  Compact Wireless Silicon-based Recording System for Small Animals
  2011 45. DGBMT Jahrestagung, Freiburg, Germany Prodeedings BMT 2011
• Ramirez H, Seidl K, Ulbert I, Paul O, Ruther P, Karwath A
  Detection of Activity Levels in High-Density Intracortical Neural Recordings Using a Machine Learning Approach
  2011 45. DGBMT Jahrestagung, Freiburg, Germany Proceedings BMT 2011
• Stephan J, Retan K, Ruther P, Paul O
  Effects of Temperature Treatment on Strain Sensors Based on the Ferromagnetic Shape Memory Alloy NiMnGa
  2011 IEEE Sensors 2011 Conference, Limerick, Ireland
• S. Kamiya, Y. Ikeda, M. Ishikawa, H. Izumi, J. Gaspar, O. Paul
  Finite Fatigue Lifetime of Silicon Under Inert Environment
  2011 , Seiten: 432 - 435
• M. Baumann, C. Sander, P. Ruther, O. Paul
  Impact of Encapsulation Materials on the Performance of Silicon-Based Solid State High Pressure Sensors With Surface Trenches
  2011 Transducers'11, Beijing, China , Seiten: 2883 - 2886
• D. Moser, A. Steffen, O. Paul
  Microstructure for the Determination of the Seebeck Coefficients of Doped Polysilicon Thin Films
  2011 9th European Conference on Thermoelectrics, Thessaloniki/Greece, 28.-30.09.2011
• M. Baumann, P. Ruther, O. Paul
  Modeling and Characterization of a CMOS Sensor With Surface Trenches for High-Pressure Applications
  2011 MEMS 2011 / Cancun, Mexico , Seiten: 601 - 604
• Froriep U P, Holzhammer T, Herwik S, Rich P D, Dalley J W, Paul O, Ruther P
  Multisite Electrode Arrays for Simultaneous LPF and Spike Recording in Freely Behaving Epileptic Mice
  2011 45. DGBMT Jahrestagung - Freiburg, Germany Proceedings BMT 2011
• J. Gaspar, J. Gutmann, B. Lemke, O. Paul
  Nonlinear Piezoresistance of Silicon at Large Stresses
  2011 IEEE MEMS 2011/ Cancun, Mexiko , Seiten: 469 - 472
• T. Kaufmann, F. Purkl, P. Ruther, O. Paul
  Novel Coupling Concept for Five-Contact Vertical Hall Devices
  2011 Transcucers'11, Beijing, China , Seiten: 2855 - 2858
• S. Herwik, T. Holzhammer, O. Paul, P. Ruther
  Out-of-Plane Assembly of 3D Neural Probe Arrays Using a Platform With SU-8-Based Thermal Actuators
  2011 Transducers'11, Beijing, China , Seiten: 2323 - 2326
• T. Martin, U. Gengenbach, P. Ruther, O. Paul, G. Bretthauer
  Silicon Linkage With Novel Compliant Mechanism for Piezoelectric Actuation of an Intraocular Implant
  2011 Transducers'11, Beijing, China , Seiten: 1480 - 1483
• B. Lemke, S. Ganapathysubramanian, R. Baskaran, O. Paul, P. Nardi
  Stress Mapping Below Flip-Chip Bumps With High Spatial Resolution Using Piezoresistive CMOS Sensors
  2011 InterPACK2011, Portland, Oregon, USA , Ergänzungsband: 52124, Seiten: 1 - 10
• Seidl K, Ulbert I, Paul O, Ruther P
  Validation of Electronic Depth Control Using CMOS-based High-Density Silicon Microprobe Arrays
  2011 45. DGBMT Jahrestagung, Freiburg, Germany Proceedings BMT 2011

2010

 nach oben zur Jahresübersicht

• V. Le Huy, J. Gaspar, O. Paul, S. Kamiya
  A Novel Fatigue Test with Ramping Stress Amplitude to Evaluate Fatigue Behaviour of Polysilicon Thin Films
  2010 IEEE MEMS2010/Hong Kong, China , Seiten: 220 - 223
• Th. Martin, U. Gengenbach, P. Ruther, O. Paul, G. Bretthauer
  Acutation of a Triple-optics for an Intraocular Implant Based on a Piezoelectric Bender and a Compliant Silicon Mechanism
  2010 12th Int. Conference on New Actuators , Seiten: 81 - 84
• M. Baumann, P. Gieschke, B. Lemke, O. Paul
  CMOS Sensor Chip with a 10x10 Array of Unit Cells for Mapping Five Stress Components and Temperature
  2010 IEEE International Conference on MEMS2010, Hong Kong, China , Seiten: 604 - 607
• K. Seidl, B. Lemke, H. Ramirez, S. Herwik, P. Ruther, O. Paul
  CMOS-based High-Density Silicon Microprobe for Stress Mapping in Intracortical Applications
  2010 IEEE International Conference on MEMS 2010, Hong Kong, China , Seiten: 35 - 38
• M. Baumann, P. Ruther, O. Paul
  CMOS-based High-Pressure Sensor Using Surface Trenches for Sensitivity Enhancement
  2010 IEEE SENSORNS 2010 Conference, Waikoloa, USA , Seiten: 2644 - 2647
• P. Gieschke, O. Paul
  CMOS-integrated Sensor Chip for In-Plane and Out-of-Plane Shear Stress
  2010 Eurosensors XXIV 2010, Linz, Austria , Seiten: 1364 - 1367
• P. Ruther, M. Baumann, P. Gieschke, M. Herrmann, B. Lemke, K. Seidl, O. Paul
  CMOS-integrated Stress Sensor Systems
  2010 IEEE SENSORS 2010 Conference, Waikoloa, USA , Seiten: 2073 - 2077
• M. Herrmann, P. Gieschke, P. Ruther, O. Paul
  CMOS-integrated Three-Axis Force Sensor for Coordinate Measurement Applications
  2010 IEEE SENSORS 2010 Conference, Waikoloa, USA , Seiten: 2648 - 2652
• G.J. Suanning, S. Kisban, S.C. Chen, P.J. Byrnes-Preston, C. Dodds, C. Tsai, P. Matteucci, S. Herwik, J.W. Morley, N.H. Lovell, O. Paul, T. Stieglitz, P. Ruther
  Discrete Cortical Responses from Multi-site Supra-Choroidal Electrical Stimulation in the Feline Retina
  2010 32nd Annual International Conference of the IEEE EMBS 2010, Buenos Aires, Argentina , Seiten: 5879 - 5882
• P. Koester, C. Tautorat, J. Held, P. Ruther, J. Gaspar, O. Paul, H. Beikirch, J. Gimsa, W. Baumann
  GO-Bio 3: PoreGenic -2. Cardiomyocyte Action Potential Recordings with a 3D-MEA chip
  2010 7th Int. Meeting on Substrate-Integrated Microelectrode Arrays, Reutlingen, Germany , Seiten: 293 - 294
• P. Koester, C. Tautorat, J. Held, P. Ruther, J. Gaspar, O. Paul, H. Beikirch, J. Gimsa, W. Baumann
  Go-Bio3: PoreGenic -1. Whole-Cell Patch Clamp Recordings with a 3D-MEA chip
  2010 7th Int. Meeting on Substrate-Integrated Microelectrode Arrays, Reutlingen, Germany , Seiten: 291 - 292
• J. Stephan, E. Pagounis, M. Laufenberg, P. Ruther, O. Paul
  Mechanical Sensing Based on Ferromagnetic Shape Memory Alloys
  2010 IEEE SENSORS 2010 Conference, Waikoloa, USA , Seiten: 2577 - 2580
• B. Lemke, M. Schmidt, J. Gutmann, P. Gieschke
  Nonlinear Piezoresistance of Silicon
  2010 IEEE SENSORS 2010, Waikoloa, USA , Seiten: 1950 - 1953
• S. Kisban, T. Holzhammer, S. Herwik, O. Paul, P. Ruther
  Novel Method for the Assembly and Electrical Contacting of Out-of-Plane Microstructures
  2010 23rd IEEE International Conference on MEMS 2010, Hong Kong, China , Seiten: 484 - 487
• J. Gaspar, M. Schmidt, G. Pedrini, W. Osten, O. Paul
  Out-of-Plane Electrostatic Microactuators with Tunable Stiffness
  2010 23rd IEEE International Conference on MEMS, Hong Kong, China , Seiten: 1131 - 1134
• B. Lemke, R. Baskaran, O. Paul
  Piezoresistive CMOS Sensor for the Localized Measurement of Five Independent Stress Components
  2010 23rd IEEE International Conference on MEMS, Hong Kong, China , Seiten: 596 - 599
• M. Kaufmann, D. Kopp, F. Purkl, M. Baumann, P. Ruther, O. Paul
  Piezoresistive Response of Five-contact Vertical Hall Devices
  2010 IEEE SENSORS 2010 Conference, Waikoloa, USA , Seiten: 562 - 565
• J. Held, J. Gaspar, P. Ruther, M. Hagner, A. Cismak, A. Heilmann, O. Paul
  Solid Silver Microneedle Electrode Arrays for Intracellular Recording Applications
  2010 7th Meeting on Substrate-Integrated Microelectrode Arrays, Reutlingen, Germany , Seiten: 247 - 248
• B. Lemke, R. Baskaran, S. Ganapathysubramanian, O. Paul
  Stress Distribution Under Electroless Nickel Bumps Extracted Using Arrays of 7x7 Piezo-FETs
  2010 IEEE SENSORS 2010 Conference, Waikoloa, USA , Seiten: 2573 - 2576
• P. Alpuim, P. Gieschke, C. Ehling, E. Marins, M.I. Vasilevskiy, M.B. Schubert, J. Gaspar, O. Paul
  Study of the Piezoresistivity of Doped Nanocrystalline Silicon Thin Films
  2010 E-MRS Spring Meeting 2010, Strasbourg, France
• G. van Dijck, A. Jezzini, S. Herwik, S. Kisban, K. Seidl, O. Paul, P. Ruther, F. Ugolotti Serventi, L. Fogassi, M. van Hulle, M. Umiltà
  Towards Automated Electrode Selection in the Electronic Depth Control Strategy for Multi-uni Recording
  2010 ICONIP 2010, Sydney, Australia , Seiten: 17 - 25

2009

 nach oben zur Jahresübersicht

• U. Bartsch, J. Gaspar, O. Paul
  A 2D electret-based resonant micro energy harvester
  2009 22nd IEEE International Conference on MEMS 2009 , Seiten: 1043 - 1046
• S. Kisban, J. Kenntner, P. Janssen, R. v. Metzen, S. Herwik, U. Bartsch, T. Stieglitz, O. Paul, P. Ruther
  A Novel Assembly Method for Silicon-Based Neural Devices
  2009 WC 2009, München, Germany , Seite: 107-110
• A.A.A. Aarts, H.P. Neves, R.P. Puers, S. Herwik, K. Seidl, P. Ruther, C. van Hoof
  A slim out-of-plane 3D implantable CMOS based probe array
  2009 Smart Systems Integration , Seiten: 258 - 263
• P. Gieschke, Y. Nurcahyo, M. Herrmann, M. Kuhl, P. Ruther, O. Paul
  CMOS integrated stress mapping chips with 32 N-type or P-type piezoresistive field effect transistors
  2009 22nd IEEE International Conference on MEMS, Sorrento, Italy , Seiten: 769 - 772
• K. Seidl, S. Herwik, Y. Nurcahyo, T. Torfs, M. Keller, M. Schüttler, H. Neves, T. Stieglitz, O. Paul, P. Ruther
  CMOS-based high-density silicon microprobe array for electronic depth control in neural recording
  2009 22nd IEEE International Conference on MEMS, Sorrento, Italy , Seiten: 232 - 235
• T. Alan, J. Gaspar, O. Paul, H.W. Zandbergen, F. Creemer, P.M. Sarro
  Characterization of Ultrathin Membranes to Enable TEM Observation of Gas Reactions at High Pressures
  2009 ASME 2009 Congress & Exposition IMECE2009, Lake Buena Vista, Florida, USA , Seiten: 1 - 5
• J. Gaspar, J. Held, G. Pedrini, W. Osten, O. Paul
  Development of calibration standards for the optical measurement of in-plane displacements of micromechanical components
  2009 22nd IEEE International Conference on MEMS, Sorrento, Italy , Seiten: 7 - 10
• R. von Metzen, D. Egert, P. Ruther, T. Stieglitz
  Diffusion Limited Tapered Coating with Parylene C
  2009 WC 2009, München, Germany , Seiten: 96 - 99
• T. Kawai, J. Gaspar, V. Le Huy, O. Paul, S. Kamiya
  Evaluation of Fatigue Behavior of Polysilicon Thin Films
  2009 JSME Mechanical Engineering Congress 2009, Morioka, Japan , Seiten: 59 - 60
• B. Lemke, R. Baskaran, O. Paul
  Evaluation of the Accuracy of Out-of-Plane Normal Stress Detection Using Novel Piezoresistive CMOS Sensors
  2009 ASME 2009 InterPACK Conference, San Francisco, California, USA , Seiten: 1 - 7
• H. Al Saeed, B. Panchaphongsaphak, P. Gieschke, I. Jonas B. Lapatki
  Experimentelle Bestimmung der Drehmoment-Kraft-Verhältnisse verschiedener Closing-Loops
  2009 82. Wissenschaftliche Jahrestagung, Deutsche Gesellschaft für Kieferorthopädie e.V. Mainz, Germany , Seite: Paper V4
• M.E. Schmidt, J. Gaspar, J. Held, S. Kamiya, O. Paul
  Highly efficient extraction of mechanical and linear and quadratic piezoresistive properties of poly-Si films using wafer-scale microtensile testing
  2009 22nd IEEE International Conference on MEMS, Sorrento, Italy , Seiten: 599 - 602
• J. Held, J. Gaspar, P.J. Koester, C. Tautorat, M. Hagner, A. Cismack, A. Heilmann, W. Baumann, P. Ruther, O. Paul
  Hollow Microneedle electrode arrays for intracellular recording applications
  2009 22nd IEEE International Conference on MEMS, Sorrento, Italy , Seiten: 220 - 223
• J. Held, J. Gaspar, M. Hagner, P. Ruther, O. Paul
  Hollow microneedle electrode arrays for intracellular recording applications
  2009 6. Deutsches BioSensor Symposium, Freiburg, Germany , Seite: 108
• U. Bartsch, C. Sander, M. Blattmann, J. Gaspar, O. Paul
  Influence of Parasitic Capacitances on the Power Output of Electret-Based Energy Harvesting Generators
  2009 PowerMEMS 2009, Washington DC, USA , Seiten: 332 - 335
• J. Held, J. Gaspar, P.J. Koester, C. Tautorat, M. Hagner, C. Cismak, A. Heilmann, W. Baumann, P. Ruther, O. Paul
  Integration of Microfluidic Features with Microneedle Electrode Arrays for Intracellular Recording Applications
  2009 Mikrosystemtechnik Kongress 2009, Berlin, Germany VDE Verlang GmbH, Seite: Paper P3.1
• K. Sriperumbudur, P. Koester, M. Stubbe, C. Tautorat, J. Held, W. Baumann, J. Gimsa
  Local Electroporation of Sigle Adherent Cells by Micro-Structured Needle Electrodes
  2009 COMSOL Conference 2009, Bangalore, India
• J. Gaspar, T. Smorodin, M.E. Schmidt, C. Bohm, M. Stecher, O. Paul
  Mechanical Characterization of CMOS Metal Layers
  2009 Transducers 2009, Denver, CO, USA , Seiten: 1706 - 1709
• M. Baumann, B. Lemke, P. Ruther, O. Paul
  Piezoresistive CMOS Sensors for Out-of-Plane Shear Stress
  2009 IEEE Sensors 2009, Christchurch, New Zealand
• T. Kawai, J. Gaspar, O. Paul, S. Kamiya
  Prediction of Strength and Fatigue Lifetime of MEMS Structures with Arbitrary Shapes
  2009 Transducers 2009, Denver, CO, USA , Seiten: 1067 - 1070
• S. Hillebrecht, S. Herwik, I. Polian, P. Ruther, B. Becker, O. Paul
  Reliability characterization of interconnects in CMOS integrated circuits under mechanical stress
  2009 IEEE CFP09RPS-CDR 47th Annual International Reliability Physics Symposium, Montreal, Canada , Seiten: 562 - 567
• M. Cornils, O. Paul
  The Magnetic Calibration of Arbitrarily Shaped Hall Sensors in the Absence of Magnetic Fields
  2009 Transducers 2009, Denver, CO, USA , Seiten: 881 - 884
• B. Lemke, K. Kratt, R. Baskaran, O. Paul
  Towards piezoresistive CMOS sensors for out-of-plane stress
  2009 22nd IEEE International Conference on MEMS, Sorrento, Italy , Seiten: 781 - 784
• B. Panchaphongsaphak, S. Rues, P. Gieschke, O. Paul, I.E. Jonas, B.G. Lapatki
  Untersuchung der Messgenauigkeit von intelligenten Brackets mittels Finite-Elemente-Analyse
  2009 82. Wissenschaftliche Jahrestagung, Deutsche Gesellschaft für Kieferorthopädie e.V. Mainz, Germany

2008

 nach oben zur Jahresübersicht

• A.A.A. Arts, H.P. Neves, I. Ulbert, L. Wittner, L. Grand, M.B.A. Fontes, S. Herwik, S. Kisban, O. Paul. P. Ruther, R.P. Puers, C. von Hoof
  A 3D Slim-Base Probe Array for in Vivo Recorded Neuron Activity
  2008 IEEE EMBS Conference, Vancouver, Canada , Seite: 5798-5801
• A.A.A. Aarts, S. Herwik, S. Kisban, P. Janssen, E. Göthelid, S. Oscarsson, M.B.A. Fontes, T. Stieglitz, O. Paul, P. Ruther, C. van Hoof
  A Silicon-Based Three-Dimensional Microprobe Array for Chronic Neural Recording
  2008 SfN Annual Meeting 2008, Washington
• G. Girardeau, K. Benchenane, S. Herwik, S. Kisban, P. Ruther, S.I. Wiener, G. Buzsaki, M.B. Zugaro
  Abolishing hippocampal ripples by timed stimulation: effects of learning
  2008 SfN Annual Meeting 2008, Washington
• M. Cornils, O. Paul
  Beyond von der Pauw: Sheet Resistance Determination from Arbitrarily Shaped Planar Four-Terminal Devices with Extended Contacts
  2008 IEEE Conference on Microelectronic Test Structures, Edinburgh, UK , Seiten: 23 - 28
• O. Paul, P. Gieschke, B. Lemke
  CMOS-Integrated Stress Sensor Systems for Mechanical Sensing and Packaging Reliability Testing
  2008 Materials Research Society Symposium, Warrendate , Seite: 1139-GG04-
• U. Bartsch, J. Gaspar, O. Paul
  Characterization of the Charging and Long-Term Performance of Cytop Electret Layers for MEMS Applications
  2008 MRS Fall Meeting 2008, Boston, USA
• M. Herrmann, P. Gieschke, Z. Liu, J. Korvink, P. Ruther, O. Paul
  Design and Characterization of In-Plane Silicon Stress Sensors with Isotropic Sensitivity
  2008 IEEE SENSORS 2008 Conference , Seiten: 1528 - 1531
• J. Gaspar, J. Held, G. Pedrini, W. Osten, O. Paul
  Development of Calibration Standards for In-Plane Displacements of Microcomponents
  2008 Eurosensors XXII, Dresden, Germany , Seiten: 613 - 616
• J. Gaspar, M. Schmidt, J. Held,, O. Paul
  Evaluation of the mechanical properties of aluminum thin films as a function of strain rate using the wafer-scale microtensile technique
  2008 MRS Fall Meeting 2008, Boston, USA
• S. Herwik, S. Kisban, A.A.A. Aarts, K.Seidl, G.Girardeau, K.Benchenane, M.B.Zugaro, S.I.Wiener, H.P.Neves, O.Paul, P.Ruther
  FABRICATION TECHNOLOGY FOR SILICON BASED MICROPROBE ARRAYS USED IN ACUTE AND SUBCHRONIC NEURAL RECORDING
  2008 19th MicroMechanics Europe Workshop 2008, Aachen, Germany , Seiten: 57 - 60
• S. Herwik, S. Kisban, A.A.A. Aarts, K. Seidl, G. Girardeau, K. Benchenane, M.B. Zugaro, S.I. Wiener, H.P. Neves, O. Paul, P. Ruther
  Fabrication Technology for Silicon Based Microprobe Arrays used in Acute and Subchronic Neural Recording
  2008 19th MicroMechanics Europe Workshop 2008, Aachen, Germany , Seiten: 57 - 60
• S. Herwik, S. Kisban, P. Janssen, S. Srivastava, K. Benchenane, G. Girardeau, M.B. Zugaro, S.I. Wiener, E. Fernandez, M. Bongard, I. Ulbert, L. Wittner, A. Jezzini, M.A. Ulmilta, L. Fogassi, T. Stieglitz, O. Paul, H.P. Neves, P. Ruther
  Fabrication and validation of 1D and 2D electrode arrays for cerebral applications developed in the framework of the NeuroProbes Project
  2008 SfN Annual Meeting 2008, Washington
• S. Kisban, D. Moser, B. Rubehn, T. Stieglitz, O. Paul, P. Ruther
  Fatigue Testing of Polyimide-Based Micro Implants
  2008 ECIFMBE 2008 , Seiten: 1594 - 1597
• P. Gieschke, J. Richter, J. Joos, P. Ruther, O. Paul
  Four-Degree-of-Freedom Solid State MEMS Joystick
  2008 IEEE International Conference on MEMS 2008, Tucson, Arizon, USA , Seiten: 86 - 89
• J. Gaspar, M. Schmidt, J. Held, O. Paul
  High-Throughput Wafer-Scale Microtensile Testing of Thin Films
  2008 IEEE International Conference on MEMS 2008, Tucson, Arizona, USA , Seiten: 439 - 442
• E. Göthelid, C. Granstam, S. Herwik, P. Ruther, H. Neves, S. Oscarsson
  Hyaluronic acid grafting on silicon surfaces
  2008 ISTEC-CNR, Faenza, Italy , Seiten: 81 - 91
• S. Kisban, P. Janssen, S. Herwik, T. Stieglitz, O. Paul, P. Ruther
  Hybrid Microprobes for Chronic Implantation in the Cerebral Cortex
  2008 IEEE EMBS Conference, Vancouver, Canada , Seiten: 2016 - 2019
• P. Gieschke, Y. Nurcahyo, M. Herrmann, M. Kuhl, P. Ruther, O. Paul
  Integrated Stress Mapping Chip with 32 Piezoresistive Field Effect Transistors
  2008 Eurosensors XXII, Dresden, Germany , Seiten: 292 - 295
• C. Tautorat, P.J. Koester, J. Held, J. Gaspar, P. Ruther, O. Paul, A. Cismak, A. Heilmann, J. Gimsa, H. Beikrich, L. Jonas, W. Baumann
  Intracellular Potential Measurement of Adherently Growing Cells Using Micro-Needle Arrays
  2008 µ-TAS, San Diego, California, USA , Seiten: 1777 - 1780
• P. Koester, C. Tautorat, J. Held, J. Gaspar, P. Ruther, O. Paul, A. Cismak, A. Heilmann, J. Gimsa, W. Baumann
  Local Micro-Invasive Needle Electroporation (LOMINE) of Single Cells Attached on Silicon Chips
  2008 13th International Biotechnology Symposium (IBS) and Exhibition, Dalian, China , Seiten: 462 - 462
• U. Bartsch, M. Blattmann, J. Gaspar, O. Paul
  Low-Frequency 2D Resonators for Vibrational Micro Energy Harvesting Applications
  2008 PowerMEMS 2008 + microEMS 2008, Sendai, Japan , Seiten: 57 - 60
• U. Bartsch, T. Huesgen, J. Gaspar, P. Woias, O. Paul
  Low-Temperature Adhesive Flip-Chip Bonding Using Cytop Combined with Electrical Stud Bump Interconnects
  2008 MME-Workshop, Aachen, Germany , Seiten: 411 - 414
• J. Gaspar, O. Paul, V. Chu, J.P. Conde
  Mechanical Properties and Reliability of Amorphous vs. Polycrystalline Silicon Thin Films
  2008 MRS Spring Meeting Material Research Society, Band: 1066, Seite: 1066-A15-0
• J. Held, J. Gaspar, P.J. Koester, C. Tautorat, A. Cismak A. Heilmann, W. Baumann, A. Trautmann, P. Ruther, O. Paul
  Microneedle Arrays for Intracellular Recording Applications
  2008 IEEE International Conference on MEMS 2008, Tucson, Arizona, USA , Seiten: 268 - 271
• J. Held, J. Gaspar, P. Ruther, O. Paul
  Microneedle Electrode Arrays with Dielectrophoresis Electrodes for Intracellular Recording Applications
  2008 Meeting on Substrate-Integrated Microelectrodes MEA, Reutlingen, Germany , Seiten: 299 - 300
• S. Spieth, A. Schumacher, K. Seidl, K. Hiltmann, S. Haeberle, R. McNamara, J.W. Dalley, S. Edgley, P. Ruther, R. Zengerle
  Microprobe systems for neural recording and drug delivery
  2008 Neuroscience 2008, Washington DC, USA
• T. Smorodin, Ch. Bohm, J. Gaspar, M. Schmidt, O. Paul, M. Stecher
  Modeling and improvement of a metallization system subjected to fast temperature cycle stress
  2008 EuroSimE, Freiburg, Germany , Seiten: 173 - 178
• T. Kawai, S. Amaki, J. Gaspar, P. Ruther, O. Paul, S. Kamiya
  Prediction of Fatigue Lifetime Based on Static Strength and Crack Extension Law-Fatigue Test of MEMS Materials Becomes Unnecessary
  2008 IEEE International Conference on MEMS 2008, Tucson, Arizon, USA , Seiten: 431 - 434
• S. Brugger, O. Paul
  Resonant Magnetic Microsensor with µT Resolution
  2008 IEEE International Conference on MEMS 2008, Tucson, Arizona, USA , Seiten: 944 - 947
• S. Spieth, A. Schumacher, K. Seidl, K. Hiltmann, S. Haeberle, R. McNamara, J.W. Dalley, S. Edgley, P. Ruther, R. Zengerle
  Robust microprobe systems for simultaneous neural recording and drug delivery
  2008 ECIFMBE 2008 , Seiten: 2426 - 2430
• S. Khumpuang, P. Ruther, O. Paul
  SU-8 Patterning on Inclined Surfaces for Micromold Fabrication
  2008 19th MicroMechanics Europe Workshop 2008, Aachen, Germany , Seiten: 109 - 112
• S. Khumpuang, P. Ruther, O. Paul
  SU-8 patterning on inclined surfaces for micromold fabricarion
  2008 19th MicroMechanics Europe Workshop 2008, Aachen, Germany , Seiten: 109 - 112
• P. Gieschke, O. Paul, I.E. Jonas, B.G. Lapatki
  Smart Bracket for 3D-Force-Moment Monitoring in Orthodontics
  2008 ESB Congress, Luzern, Switzerland , Seite: 216
• M. Schmidt, J. Gaspar, J. Held, O. Paul
  Strain Rate Dependent Mechanical Properties of Aluminium Thin Films Measured Using the Microtensile Test
  2008 Eurosensors XXII, Dresden, Germany , Seiten: 1603 - 1606
• M. Cornils, O. Paul
  The Magnetic Calibration and Optimization of Symmetric Hall Plates May be Accomplished even in the Absence of a Magnetic Field
  2008 IEEE International Conference on MEMS 2008, Tucson, Arizona, USA , Seiten: 940 - 943
• P. Ruther, A. Arts, O. Frey, S. Herwik, S. Kisban, K. Seidl, S. Spieth, A. Schumacher, M. Koudelka-Hep, O. Paul, T. Stieglitz, R. Zengerle, H. Neves
  The NeuroProbes Project - Multifunctional Probe Arrays for Neuro Recording and Stimulation
  2008 Annual Conference of the IFESS, Freiburg, Germany , Seiten: 238 - 240
• H.P. Neves, T. Torfs, R.F. Yazicioglu, J. Aslam, A.A. Aarts, P. Merken, P. Ruther,, C. Van Hoof
  The NeuroProbes project: a concept for electronic depth control
  2008 30th Annual International IEEE EMBS Conference, Vancouver, Canada , Seiten: 1857 - 1857
• T. Huesgen, U. Bartsch, B. Albrecht, P. Vulto, J. Gaspar, P. Woias
  Wafer-Level Dry-Film Photoresist Adhesive Bonding for 3D-MEMS Integration and Packaging
  2008 MME, Aachen, Germany , Seiten: 255 - 258

2007

 nach oben zur Jahresübersicht

• U. Bartsch, C. Bretthauer, T. Hehn, B. Mack, T. Ungan, Y. Manoli, O. Paul, L. Reindl, H. Reinecke, U. Wallrabe
  Angewandtes "Micro Energy Harvesting"-Systemkonzept für energieautarke Mikrosysteme
  2007 Mikrosystemtechnik Kongress 2007 , Seiten: 797 - 800
• J. Gaspar, T. Smorodin, M. Stecher, O. Paul
  Bulge testing of silicon nitride thin films at the wafer level
  2007 Mikrosystemtechnik Kongress 2007, Dresden, Germany , Seiten: 881 - 884
• P. Gieschke, J. Held, M. Dölle, J. Bartholomeyczik, P. Ruther, O. Paul
  CMOS Integrated Smart Cilia
  2007 Mikrosystemtechnik Kongress 2007, Dresden , Seiten: 381 - 384
• B. Levey, P. Gieschke, M. Dölle, S. Spinner, A. Trautmann, P. Ruther, O. Paul
  CMOS-Integrated Silicon 3D Force Sensor System for Micro Component Coordinate Measurement Machines
  2007 IEEE MEMS Conference, Kobe, Japan , Seiten: 611 - 614
• P. Ruther, S. Spinner, M. Cornils, O. Paul
  Cantilever-Based Tactile Sensor With Improved Sensitivity for Dimensional Metrology of Deep Narrow Drillings
  2007 Transducers & Eurosensors'07, Lyon, France , Seiten: 1469 - 1472
• S. Spinner, M. Cornils, O. Paul, P. Ruther
  Cantilever-Based Tactile Sensor With Improved Sensitivity for Dimensional Metrology of Microcomponents
  2007 Mikrosystemtechnik Kongress 2007, Dresden
• K. Seidl, S. Spieth, S. Herwik, O. Paul, P. Ruther
  Cerebral Microprobes for Neural Recording Combined With Fluidic Functionality
  2007 Biomed Tech, Berlin, Germany
• J. Held, J. Gaspar, P. Ruther, O. Paul
  Characterization of the DRIE Fabrication of Cell-Penetrating Microneedles
  2007 Mikrosastemtechnik Kongress 2007, Dresden, Germany , Seiten: 845 - 848
• N. Haj-Hosseini, R. Hoffmann, S. Kisban, T. Stieglitz, O. Paul, P. Ruther
  Comparative Study on the Insertion Behavior of Cerebral Microprobes
  2007 IEEE EMBS 2007, Lyon, France , Seiten: 4711 - 4714
• J. Gaspar, M. Schmidt, O. Paul
  Comparison of Improved Bulge and Microtensile Techniques for Mechanical Thin Film Characterization-Application of Polysilicon
  2007 Transducers & Eurosensors'07, Lyon, France , Seiten: 575 - 578
• H.P. Neves, G.A. Orban, M. Koudelka-Hep, T. Stieglitz, P. Ruther
  Development of Modular Multifunctional Probe Arrays for Cerebral Applications
  2007 IEEE EMBS Conf. on Neural Engineering, Kohala Coast, Hawaii, USA , Seiten: 104 - 109
• U. Bartsch, A. Trautmann, P. Ruther, J. Gaspar, O. Paul
  Electromechanical Transducers for Micro Energy Harvesting Based on SOI-Technology
  2007 Transducers & Eurosensors'07, Lyon, France , Seiten: 141 - 144
• U. Bartsch, J. Gaspar, P. Ruther, O. Paul
  Electrostatic Micro Energy Harvesting Devices Based on SOI-Technology
  2007 Mikrosystemtechnik Kongress 2007, Dresden, Germany , Seiten: 785 - 788
• U. Bartsch, P. Ruther, O. Paul
  Elektromechanischer Energiewandler basierend auf SOI-Technologie
  2007 Technisches Messen 74, Oldenbourg Verlag, Seiten: 636 - 641
• P. Gieschke, B. Lapatki, J. Bartholomeyczik, O. Paul
  First 1:1 Scale Smart Orthodontic Bracket
  2007 Smart System Integration, Paris, France , Seiten: 207 - 214
• S. Kamiya, T. Ozeki, K. Hirata, J. Gaspar, O. Paul, T. Inoue, H. Jindo
  Fracture Strength and Fatigue Lifetime Prediction of Single Crystalline Silicon on the Basis of Process Induced Damages
  2007 Int. Conf. on Advanced Technology in Experimental Mechanics, Fukuoka, Japan , Seiten: 41 - 46
• S. Brugger, O. Paul
  Geometric Optimization and Microstructuring of Magnetic Concentrators for a Resonant Magnetic Sensor
  2007 Transducers & Eurosensors'07, Lyon, France , Seiten: 2377 - 2380
• J. Gaspar, Y. Nurcahyo, P. Ruther, O. Paul
  Mechanical Characterization of Silicon Nitride Thin-Films Using Microtensile Specimens With Integrated 2D Diffraction Gratings
  2007 IEEE MEMS Conference 2007, Kobe, Japan , Seiten: 223 - 226
• J. Gaspar, P. Ruther, O. Paul
  Mechanical Characterization of Thin-Film Composites Using the Load-Deflection Response of Multilayer Membranes - Elastic and Fracture Properties
  2007 Materials Research Society Symposium 2007, Boston, USA
• P. Ruther, B. Lapatki, A. Trautmann, O. Paul
  Micro Needle Based Electrode Arrays for Surface Electromyography
  2007 Mikrosystemtechnik Kongress 2007, Dresden, Germany , Seiten: 735 - 738
• S. Kisban, S. Herwik, K. Seidl, B. Rubehn, A. Jezzini, M.A. Umiltà, L. Fogassi, T. Stieglitz, O. Paul, P. Ruther
  Microprobe Array With Low Impedance Electrodes and Highly Flexible Polyimide Cables for Acute Neural Recording
  2007 Int. Conf. of the IEEE EMBS, Lyon, France , Seiten: 175 - 178
• J. Gaspar, M. Schmidt, J. Held, O. Paul
  Microtensile Testing of Thin-Film Materials
  2007 Mikrosystemtechnik Kongress 2007, Dresden, Germany , Seiten: 865 - 868
• P. Ruther, S. Herwik, S. Kisban, K. Seidl, S. Spieth, B. Rubehn, N. Haj-Hosseini, J. Steigert, M. Daub, O. Paul, T. Stieglitz, R. Zengerle, H. Neves
  NeuroProbes - Development of Modular Multifunctional Probe Arrays for Neuroscience
  2007 Mikrosystemtechnik Kongress 2007, Dresden, Germany , Seiten: 739 - 742
• S. Brugger, W. Pfleging, O. Paul
  Novel Fabrication Process for the Integration of MEMS Devices With Thick Amorphous Soft Magnetic Field Concentrators
  2007 Materials Resarch Society Symposium 2007, Boston, USA , Band: 1052, Nummer: DD07, Ergänzungsband: 11
• J. Gaspar, M. Schmidt, J. Held, O. Paul
  Reliability of MEMS Materials: Mechanical Characterization of Thin-Films Using the Wafer Scale Bulge Test and Improved Microtensile Techniques
  2007 Material Research Society Symposium 2007, Boston, USA , Band: 1052, Nummer: DD01, Ergänzungsband: 02
• M. Cornils, O. Paul
  Sensor Calibration of Planar Four-Contact Devices With up to Two Extended Contacts
  2007 Mikrosystemtechnik Kongress 2007, Dresden, Germany , Seiten: 893 - 896
• M. Cornils, O. Paul
  Sensor Calibration of Planar Four-Contact Devices With up to Two Extended Contacts
  2007 IEEE Sensors 2007, Atlanta, USA , Seiten: 1259 - 1262
• P. Gieschke, J. Held, M. Dölle, J. Bartholomeyczik, P. Ruther, O. Paul
  Smart Brush Based on a High Density CMOS Stress Sensor Array and SU-8 Microposts
  2007 IEEE MEMS Conference 2007, Kobe, Japan , Seiten: 631 - 634
• J. Held, J. Gaspar, P. Ruther, M. Hagner, A Cismak, A. Heilmann, O. Paul
  Systematic Characterization of DRIE-Based Fabrication Process of Silicon Microneedles
  2007 Material Research Society Symposium, Boston, USA , Band: 1052, Nummer: DD07, Ergänzungsband: 07
• P. Gieschke, B. Levey, M. Dölle, A. Trautmann, P. Ruther, O. Paul
  Tactile CMOS-Integrated 3D Force Sensor System
  2007 Mkrosystemtechnik Kongress 2007, Dresden, Germany , Seiten: 759 - 762
• H.P. Neves, P. Ruther
  The NeuroProbes Project
  2007 Int. Conf. of the IEEE EMBS, Lyon, France , Seiten: 6442 - 6444

2006

 nach oben zur Jahresübersicht

• A. Trautmann, F. Heuck, R. Denfeld, P. Ruther, O. Paul
  Detachable Silicon Microneedle Stampus for Allergy Skin Prick Testing
  2006 IEEE MEMS 2006 Conference, Istanbul, Turkey , Seiten: 434 - 437
• S. Spinner, J. Bartholomeyczik, B. Becker, M. Dölle, O. Paul
  Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors
  2006 DTIP of MEMS & MOEMS, Stresa, Italy , Seiten: 77 - 82
• U. Bartsch, A. Trautmann, O. Paul, P. Ruther
  Elektromechanischer Energiewandler basierend auf SOI-Technologie
  2006 4. GMM Workshop Energieautarke Sensorik, Karlsruhe, Germany , Seiten: 99 - 102
• S. Brugger, P. Simon, O. Paul
  Field Concentrator Based Resonant Magnetic Sensor
  2006 IEEE Sensors 2006, EXCO, Deagu, Korea , Seiten: 1016 - 1019
• J. Yang, O. Paul
  Fracture Properties of Thermal Silicon Oxide Thin Films from the Load-Deflection of Long SiNx/SiO2 Membranes
  2006 IEEE Int. Conf. on Nano/Micro Engineered and Molecular Systems, Zhuhai, China , Seiten: 1362 - 1367
• P. Ruther, J. Barholomeyczik, S. Kibbel, T. Schelb, P. Gieschke, O. Paul
  Integrated CMOS-Based Sensor Array for Mechanical Stress Mapping
  2006 IEEE Sensors 2006, EXCO, Deagu, Korea , Seiten: 1131 - 1134
• J. Bartholomeyczik, J. Häfner, B. Lapatki, R. Ruther, T. Schelb, O. Paul
  Integrated Six-Degree-of-Freedom Sensing for Orthodontic Smart Brackets
  2006 IEEE MEMS 2006 Conference, Istanbul, Turkey , Seiten: 690 - 693
• P. Ruther, M. Dölle, J. Bartholomeyczik, P. Gieschke, O. Paul
  Integrierte Stresssensorik: Neue Techniken und Systeme
  2006 ITG/GMA-Fachtagung Sensoren und Messsysteme, Freiburg, Germany , Seiten: 60 - 64
• S. Spinner, J. Bartholomeyczik, B. Becker, M. Dölle, O. Paul, I. Polian, R. Roth, K. Seitz, P. Ruther
  Reliability Testing of Three-Dimensional Silicon Force Sensors
  2006 18th ITG/GMM-Workshop Testmethoden und Zuverlässigkeit von Schaltungen und Systemen, Titisee-Neustadt, Germany , Seiten: 111 - 112
• M. Dölle, J. Held, P. Ruther, O. Paul
  Simultaneous and Independent Measurement of Stress and Temperature Using a Single Field Effect Transistor Based Sensor
  2006 IEEE MEMS 2006 Conference, Istanbul, Turkey , Seiten: 150 - 153
• J. Gaspar, P. Ruther, O. Paul
  Strength of LPCVD Silicon Nitride Thin Films
  2006 3rd Int. Conf. on Multiscale Materials Modeling 2006, Freiburg, Germany , Seiten: 966 - 969
• O. Paul, M. Dölle, J. Held, P. Ruther
  Unabhängige Stress- und Temperaturmessung mit Feldeffekt-Transistoren
  2006 ITG/GMA-Fachtagung Sensoren und Messsysteme, Freiburg, Germany , Seiten: 139 - 144

2005

 nach oben zur Jahresübersicht

• O. Paul, P. Ruther, J. Bartholomeyczik, M. Dölle
  CMOS MEMS - A Critical Review
  2005 Micromechanics Europe Workshop MME 2005, Göteborg, Sweden , Seiten: 24 - 31
• J. Bartholomeyczik, S. Kibbel, P. Ruther, O. Paul
  Extraction of Compensated Sxx-Syy and Sxy Stresses from a Single Four-Contact
  2005 IEEE MEMS 2005 Conference, Miami Beach, USA , Seiten: 267 - 270
• M. Dölle, D. Mager, P. Ruther, O. Paul
  Geometry Dependent Sensitivity of Piezoresistive Stress Sensors Based on the Pseudo-Hall-Effect
  2005 IEEE MEMS 2005 Conference, Miami Beach, USA , Seiten: 236 - 266
• J. Bartholomeyczik, P. Ruther, O. Paul
  Novel Cartesian Lattice Spinning Method for the Simple Extraction of Sxx-Syy and Sxy Stresses and the Hall Voltage From Four-Contact Elements
  2005 Transducers 05 Conference, Seoul, Korea , Seiten: 2127 - 2130
• M. Dölle, P. Ruther, O. Paul
  Novel Highly Miniaturized Multi-Stress Sensor Based on Field Effect Transducers With Eight Source/Drain Terminals
  2005 Transducers 05 Conference, Seoul, Korea , Seiten: 321 - 324
• A. Trautmann, P. Ruther, O. Paul
  Replication of Microneedle Arrays Using Vacuum Casting and Hot Embossing
  2005 Transducers 05 Conference, Seoul, Korea , Seiten: 1420 - 1423
• A. Trautmann, F. Heuck, C. Müller, P. Ruther, O. Paul
  Replication of Microneedle Arrays Using Vacuum Casting and Hot Embossing
  2005 Mikrosystemtechnik Kongress 2005, Freiburg, Germany VDI-VDE-IT

2004

 nach oben zur Jahresübersicht

• P. Ruther, M. Herrscher, O. Paul
  A Micro Defferential Thermal Analysis (uDTA) System
  2004 IEEE MEMS 2004 Conference, Maastricht, Holland , Seiten: 165 - 168
• M. Schuster, N. Klein, P. Ruther, A. Trautmann, O. Paul, P. Kuzel, F. Kadlec
  An Interconnected 2D-TM EBG Structure for Millimetr and Sub-Millimetre Waves
  2004 Int. Symp. on Photonic and Electromagnetic Crystal Structures V
• S. Kamiya, J. Kuypers, A. Trautmann, P. Ruther, O. Paul
  Annealing Temperature Dependent Strength of Polysilicon Measured Using a Novel Tensile Test Structure
  2004 IEEE MEMS 2004 Conference, Maastricht, Holland , Seiten: 185 - 188
• A. Trautmann, P. Ruther, W. Baumann, M. Lehmann, O. Paul
  Fabrication of Out-of-Plane Electrodes for Intracellular Potential Measurements on Living Adherent Cells
  2004 SEMEA-Meeting 2004, Tübingen, Germany , Seiten: 79 - 79
• S. Armbruster, F. Schäfer, G. Lammel, J. Brasas, C. Schelling, S. Finkbeiner, M. Illing, P. Ruther, O. Paul
  Surface Micromachining of Monocrystalline Silicon Membranes Using a Silicon Micro Grid on Sintered Porous Silicon
  2004 Eurosensors XVIII Conference, Rome, Italy , Seiten: 22 - 23
• A. Trautmann, P. Ruther, W. Baumann, M. Lehmann, O. Paul
  Three-Dimensional Nanoelectrodes for Biomedical Investigations on Living Cell Networks
  2004 Eirpsemsprs XVIII Conference, Rome, Italy , Seiten: 140 - 141
• M. Dölle, C. Peters, P. Gieschke, P. Ruther, O. Paul
  Two-Dimensional High Density Piezo-FET Stress Sensor Arrays for In-Situ Monitoring of Wire Bonding Processes
  2004 IEEE MEMS 2004 Conference, Maastricht, Holland , Seiten: 829 - 832

2003

 nach oben zur Jahresübersicht

• S. Armbruster, F. Schäfer, G. Lammel, H. Artmann, C. Schelling, H. Benzel, S. Finkbeiner, F. Lärmer, P. Ruther, O. Paul
  A Novel Micromachining Process for the Fabrication of Monocrystalline Si-Membranes Using Porous Silicon
  2003 Transducers 2003, Boston, USA , Seiten: 246 - 249
• P. Ruther, J. Bartholomeyczik, A. Buhmann, O. Paul
  Characterization of Microelectromechanical HF Resonators Fabricated Using a SOI-Based Low Temperature Process
  2003 IEEE Sensors 2003 Conference, Toronto, Canada , Seiten: 820 - 824
• P. Ruther, M. Ehmann, T. Lindemann, O. Paul
  Dependence of the Temperature Distribution in Micro Hotplates on Heater Geometry and Heating Mode
  2003 Transducers 2003, Boston, USA , Seiten: 73 - 76
• T. Kramer, O. Paul
  Mechanical Properties of Compressively Prestressed Thin Films Extracted From Pressure Dependent Ripple Profiles of Long Membranes
  2003 IEEE MEMS 2003 Conference, Kyoto, Japan , Seiten: 678 - 681
• U. Wagner, R. Müller-Fiedler, J. Bagdahn, B. Michel, O. Paul
  Mechanical Reliability of Epipoly MEMS Structures Under Shock Load
  2003 Transducers 2003 Conference, Boston, USA , Seiten: 175 - 178
• A. Trautmann, P. Ruther, O. Paul
  Microneedle Arrays Fabricated Using Suspended Etch Mask Technology Combined With Fluidic Through Wafer Vias
  2003 IEEE MEMS 2003 Conference, Kyoto, Japan , Seiten: 682 - 685
• J. Bartholomeyczik, P. Ruther, A. Buhmann, K. Steffen, O. Paul
  Novel Low Temperature SOI-Based Fabrication Process for High Frequency Micromechanical Resonators
  2003 Eurosensors XVII, Guimaraes, Portugal , Seiten: 779 - 782
• M. Dölle, P. Ruther, O. Paul
  Novel Stress Sensors Based on the Pseudo-Hall Response of MOSFETs
  2003 IEEE MEMS 2003 Conference, Kyoto, Japan , Seiten: 490 - 493
• U. Wagner, W. Bernhard, R. Müller-Fiedler, B. Michel, O. Paul
  Reliability of Micromachined Membranes Under Particle Impact
  2003 Transducers 2003 Conference, Boston, USA , Seiten: 436 - 439
• A. Trautmann, R. Haug, P. Ruther, O. Paul
  Robustness of Silicon Microneedle Arrays Penetrating Into Bulk Materials
  2003 Eurosensors XVII, Guimaraes, Portugal , Seiten: 414 - 417
• M. Dölle, P. Ruther, O. Paul
  Shear Stress Sensitive Piezo-FET Stress Sensors With Offset Reduction of Nonmechanical Contributions
  2003 Eurosensors XVII 2003, Guimaraes, Portugal , Seiten: 189 - 192
• P. Ruther, K. Colelli, H.-P. Frerichs, O. Paul
  Surface Conductivity of a CMOS Silicon Nitride Layer
  2003 IEEE Sensors 2003 Conference, Toronto, Canada , Seiten: 990 - 995
• O. Paul, T. Kramer
  Symmetry Transitions of Compressively Prestressed Long Membranes Under Pressure
  2003 Transducers 2003 Conference, Boston, USA , Seiten: 432 - 435
• O. Paul, P. Ruther
  Testing the Limits of Silicon Technology Based MEMS Materials
  2003 Intl. Symposium on Micromechanics and Human Science 2003, Nagoya, Japan , Seiten: 1 - 9

2002

 nach oben zur Jahresübersicht

• P. Ruther, U. Schiller, W. Büsser, R. Janke, O. Paul
  Influence of the Junction Field Effect on the Offset Voltage of Integrated Hall Plate
  2002 Eurosensors XVI 2002 Conference, Prague, Czech Republic , Seiten: 1209 - 1212
• A. Trautmann, P. Ruther, O. Paul
  Novel Microneedle Arrays Fabricated Using Suspended Etch Masks
  2002 Eurosensors XVI 2002 Conference, Prague, Czech Republic , Seiten: 433 - 436
• M. Ehmann, T. Lindemann, P. Ruther, O. Paul
  Temperature Distribution in Micro Hotplates
  2002 MME 2002 Workshop, Sinaia, Romania , Seiten: 307 - 310
• M. Ehmann, P. Ruther, F. Schubert, O. Paul
  Thermally Activated Aging of Polysilicon
  2002 IEEE Sensors 2002 Conference, Orlando, USA , Seiten: 602 - 606
• P. Ruther, W. Büsser, R. Janke, U. Schiller, O. Paul
  Thermomagnetic Residual Offset in Integrated Hall Plates
  2002 IEEE Sensors 2002 Conference, Orlando, USA , Seiten: 763 - 766

2001

 nach oben zur Jahresübersicht

• A. Schaufenbühl, N. Schneeberger, U. Münch, M. Wälti, O. Paul, O. Brand, H. Baltes, C. Menolfi, Q. Huang, E. Döring, M. Löpfe
  256-Pixel CMOS-Integrated Thermoelectric Infrared Sensor Array
  2001 IEEE MEMS 2001 Conference, Interlaken, Switzerland , Seiten: 200 - 203
• M. Ehmann, P. Ruther, M. von Arx, H. Baltes, O. Paul
  Aging Behavior of Polysilicon Heaters for CMOS Microstructures Operated at Temperatures up to 1200 K
  2001 IEEE MEMS 2001 Conference, Interlaken, Switzerland , Seiten: 147 - 150
• J. Yang, C. Peters, O. Paul
  Fracture Properties of LPCVD Silicon Nitride Thin Films from the Load-Deflection of Long Membranes
  2001 Transducers 2001 Conference, Munich, Germany , Seiten: 1394 - 1397
• W. Menz, O. Paul, J. Rühe, H. Zappe
  Material Considerations for Micromachine Technology
  2001 Int. Symposia on Materials Science for the 21st Century, Osaka, Japan The Society of Materials Science, Japan, Band: A, Seiten: 112 - 123
• U. Wagner, J. Franz, M. Schweiker, W. Bernhard, R. Müller-Fiedler, B. Michel, O. Paul
  Mechanical Reliability of MEMS-Structures Under Shock Load
  2001 12th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France , Seiten: 1657 - 1662
• T. Kramer, T. Brenner, O. Paul
  Postbuckled Micromachined Square Membranes under Differential Pressure
  2001 Micromachining Europe MME 2001, Cork, Ireland , Seiten: 289 - 292
• S. Hafizovic, O. Paul
  Temperature Dependent Thermal Conductivities of CMOS Layers by Micromachined Thermal van der Pauw Test Structures
  2001 Transducers 2001 Conference, Munich, Germany , Seiten: 1398 - 1401

2000

 nach oben zur Jahresübersicht

• P. Ruther, M. Burg, C. Steinert, O. Paul
  Humidity Micro Sensors Using Silica Aerogel Thin Films
  2000 Eurosensors XIV Conference, Copenhagen, Denmark , Seiten: 79 - 82
• M. Ehmann, P. Ruther, O. Paul
  Operation and Aging of Polysilicon-Heated Microstructures at Temperatures up to 1100 K
  2000 Micromachining Europe MME 2000, Uppsala, Sweden
• T. Kramer, O. Paul
  Surface Micromachined Ring Test Structures to Determine Mechanical Properties of Compressive CMOS IC Thin Films
  2000 Eurosensors XIV 2000 Conference, Copenhagen, Denmark , Seiten: 25 - 28

1999

 nach oben zur Jahresübersicht

• O. Paul, L. Plattner, H. Baltes
  A Thermal van der Pauw Test Structure
  1999 IEEE ICMTS 99, Gothenberg, Sweden , Seiten: 56 - 61
• V. Ziebart, O. Paul, H. Baltes
  Extraction of the Coefficient of Thermal Expansion of Thin Films From Buckled Membranes
  1999 MRS Fall Meeting, Boston, USA , Seiten: 103 - 108
• L. Plattner, M. Mayer, Ch. Lüchinger, O. Paul, H. Baltes
  In-Situ Measurement of Chip Temperature During Soft Solder Die Bonding Using Integrated Microsensors
  1999 IMAPS99, Chicago, USA , Seiten: 213 - 220
• M. Mayer, J. Schwizer, O. Paul, H. Baltes
  In-Situ Ultrasonic Stress Measurements During Ball Bonding Using Integrated Piezoresistive Microsensors
  1999 Interpack 99, Maui, USA , Seiten: 973 - 978
• M. Mayer, O. Paul, D. Bolliger, H. Baltes
  Integrated Temperature Microsensors for Characterization and Optimization of Thermosonic Ball Bonding Process
  1999 IEEE ICTC 99, San Diego, USA , Seiten: 463 - 468
• N. Schneeberger, O. Paul, H. Baltes
  Spectral infrared absoprtion of CMOS thin film stacks
  1999 IEEE MEMS 1999, Orlando, USA , Seiten: 106 - 110
• U. Münch, H. Baltes, O. Paul, E. Doering
  Stress analysis of standard CMOS process
  1999 SPIE 1999, Gold Coast, Australia , Seiten: 344 - 351
• J. Schwizer, M. Mayer, O. Paul, D. Bolliger, H. Baltes
  Thermosonic Ball Bonding: Friction Model Based on Integrated Microsensor Measurements
  1999 25th IEEE/CPMT IEMT Symposium, Austin, USA , Seiten: 108 - 114
• A. Schaufelbuehl, N. Schneeberger, U. Muench, O. Paul, H. Baltes, C. Menolfi, Q. Huang
  Uncooled Low-Cost Thermal Imager Using Micromachined CMOS Integrated Sensor Array
  1999 Transducers 1999, Sendai, Japan , Seiten: 606 - 609

1998

 nach oben zur Jahresübersicht

• H. Baltes, O. Brand, O. Paul
  CMOS MEMS technology and CAD: the case of thermal microtransducers
  1998 SPIE 1998 Symposium on Smart Structures and Materials, San Diego, USA , Band: 3328, Seiten: 2 - 12
• S. Koller, V. Ziebart, O. Paul, O. Brand, H. Baltes, P.M. Sarro, M.J. Vellekoop
  Determination of mechanical material properties of piezoelectric ZnO films
  1998 SPIE 1998 Symposium on Smart Structures and Materials, San Diego, USA , Band: 3328, Seiten: 102 - 109
• F. Mayer, G. Ofner, O. Paul, H. Baltes
  Flip-chip packaging for smart MEMS
  1998 SPIE 1998 Symposium on Smart Structures and Materials, San Diego, USA , Band: 3328, Seiten: 183 - 193
• M. Mayer, O. Paul, D. Bolliger, H. Baltes
  In-Situ Calibration of Wire Bonder Ultrasonic System Using Integrated Microsensor
  1998 EPTC 98, Singapore , Seiten: 21- - 223
• M. Mayer, O. Paul, H. Baltes
  In-situ measurement of temperature and stress under bonding pads during bonding using integrated microsensors
  1998 EMIT '98, Bangalore, India , Seiten: 129 - 133
• M. Waelti, N. Schneeberger, O. Paul, H. Baltes
  Low Temperature Packaging of CMOS Infrared Microsystems by Si-Al-Au Bonding
  1998 Annual Symposium Elekctrochem. Soc. 1998, Paris, France , Seiten: 147 - 154