Projects
Inline-integration of a novel printing technology for electronic applications in the industrial production
Project description
In the production of innovative electronic components such as micromechanical sensors and smart-systems, conventional production methods reach their limits when it comes to forming electrical interconnections. In order to provide a flexible, digital method as an alternative, the University of Freiburg has developed the Star-Jet direct printing technology that enables the non-contact printing of small amounts of solder as molten microdroplets. By using molten solder without additives instead of solder pastes, reflow processes that usually need to be performed can potentially be omitted in production. Besides the cost-saving aspect, also miniaturization and digitalization of the production process can be enhanced. To enable the use of the StarJet technology in the production process for electrical interconnections, a continued development of the printhead is needed, aiming to increase the stability of the printing process. This is carried out with the needs of the industrial fabrication process in mind. After the development of a new prototype, the printhead is evaluated by the companies involved as partners in the project for their specific applications. Therefore, the StarJet-printhead is integrated in different production platforms, addressing prototype as well as large scale production and suitable metallization processes by direct printing are developed.
Start/End of project
01.10.2016 until 31.10.2018
Project manager
Björn Gerdes (Prof. Dr. Roland Zengerle)
Contact person
Björn Gerdes
Phone:+49 761 203-73265
Email:bjoern.gerdes@imtek.uni-freiburg.de
Partners
arteos GmbH (http://www.arteos.com)
BioFluidix GmbH (http://www.biofluidix.com/)
Häcker Automation GmbH (http://haecker-automation.de/)
QuRisMa GmbH
Funding
BMBF
Keywords
Metalldosierung, Silizium, Halbleiter, Mikrodosierung, Verbindungstechnik, Automation, Prozessentwicklung, liquid metal, silicon and other semiconductors, microdosing, assembly and packaging, automation & process engineering