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Project description

We develop and fabricate 3D-force sensors based on micromechanical cross-structures suspended inside a silicon frame using membrane hinges. Tactile pins carrying small sapphire spheres are assembled onto the cross-structures to enable the structural evaluation of microcomponents. Piezoresistive silicon sensors integrated into the membrane hinges enable the detection of smallest cross-structure deformations caused by the tactile interaction between the tactile pin and the micro object. The MEMS-based 3D-force sensors are applied in state-of-the-art coordinate measurement machines (CMM) developed by ZEISS, Oberkochen, Germany.

Start/End of project

01.02.2008 until 31.08.2011

Project manager

Prof. Dr. Oliver Paul

Contact person

Prof. Dr. Oliver Paul
Phone:+49 761 203 7191


Carl Zeiss GmbH
Benutzerspezifische Werkzeuge