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Fabrication processes to determine the fracture-mechanical properties in thin polysilicon layers

Project description

We realize, based in our wafer-level micro-tensile test setup, MEMS structures to determine the fracture-mechanical properties auf thin polysilicon layers realized and patterned by low pressure chemical vapor deposition (LPCVD) and reactive ion etching (RIE), respectively.

Start/End of project

14.12.2010 until 15.03.2011

Project manager

Prof. Dr. Oliver Paul

Contact person

Prof. Dr. Oliver Paul
Phone:+49 761 203 7190


Nagoya Institute of Technology (NIT), Japan
Benutzerspezifische Werkzeuge